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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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The Relevance of VeCS as an HDI Process Option

08/20/2026 | Marcy LaRont, I-Connect007
Almost 10 years ago, Pete Starkey interviewed Joan Tourné, inventor and CEO of his new company, NextGin Technology. Joan’s resume included many years as a director at Mommers Print Service in the Netherlands, and then as advanced technology and business director with Viasystems Group. He had just secured his IP for a vertical conductive structure (VeCS), a novel means of creating high density vertical interconnections for semiconductors and complex, high layer count PCBs. This month, we re-examine VeCS technology, a method for HDI PCB fabrication with large backplane-type boards developed in partnership with Wus, which uses the technology in its factories.

2024 Stromberg Student Leader Scholarship Recipient Announced

11/05/2024 | SMTA
SMTA is pleased to announce Waad Tarman, Auburn University, has been selected as the recipient of the 2024 JoAnn Stromberg Student Leader Scholarship.

2023 Stromberg Student Leader Scholarship Recipient Announced

09/26/2023 | SMTA
SMTA is pleased to announce Catherine Wong, Foothill College, has been selected as the recipient of the 2023 JoAnn Stromberg Student Leader Scholarship.

SMTA Seeks Applications for 2023 Stromberg Scholarship

02/02/2023 | SMTA
The SMTA is excited to announce they are currently accepting student applications for the JoAnn Stromberg Student Leader Scholarship by April 28, 2023.

SMTA: 2022 Stromberg Student Leader Scholarship Recipient Announced

10/18/2022 | SMTA
SMTA is pleased to announce Emily Williams, Lorain County Community College, has been selected as the recipient of the 2022 JoAnn Stromberg Student Leader Scholarship.
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