-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueRules of Thumb
This month, we delve into rules of thumb—which ones work, which ones should be avoided. Rules of thumb are everywhere, but there may be hundreds of rules of thumb for PCB design. How do we separate the wheat from the chaff, so to speak?
Partial HDI
Our expert contributors provide a complete, detailed view of partial HDI this month. Most experienced PCB designers can start using this approach right away, but you need to know these tips, tricks and techniques first.
Silicon to Systems: From Soup to Nuts
This month, we asked our expert contributors to weigh in on silicon to systems—what it means to PCB designers and design engineers, EDA companies, and the rest of the PCB supply chain... from soup to nuts.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - design007 Magazine
Latest Advancements in High-Reliability Electronics Focus of 2024 IPC High Reliability Forum
August 12, 2024 | IPCEstimated reading time: 1 minute
Ensuring reliability in high-voltage electronics, a new standardized test method for abrasion resistance of e-textiles, and assembly and solder joint X-ray challenges are just a few of technical conference topics offered at IPC’s High Reliability Forum, October 9-10 at the McKimmon Center in Raleigh, N.C.
Additional presentation topics cover: safety critical electronics considerations; military, aerospace, medical, automotive, e-Mobility and other applications with specialized reliability requirements; and industry-curated content covering many different topics related to high reliability issues in PCB design, PCB fabrication materials, PCB assembly, PCBA surface reliability, emerging electronic technologies, mitigation strategies and test methods.
Speakers from the following companies include Denis Barbini, Ph.D., Zestron; Steven Dirkes, U.S. Army; Ben Gumpert, Lockheed Martin; Norbert Holle, Ph.D., Robert Bosch GmbH; Takenori Kakutani, Taiyo Ink Manufacturing; Tony Lentz, FCT Assembly; Bob Neves, Microtek Laboratories & Reliability Assessment Solutions; Tim Pearson, Collins Aerospace; Erin Tillery, NC State University; and Udo Welzel, Ph.D., Robert Bosch GmbH.
“The event provides a unique opportunity for those in industry who design, manufacture, or test electronics for critical applications with unique safety, reliability, and lifetime requirements to obtain the latest research on high-reliability electronics,” said Teresa Rowe, IPC senior director, assembly and standards technology. “This year, attendees will learn about the newest research and emerging trends in high-reliability electronics, hear from subject matter experts, connect with exhibitors and peers, and take advantage of several networking opportunities during the course of the two-day forum.”
IPC High Reliability Forum will be co-located with IPC Builds which is being held October 5-10, 2024, at the McKimmon Center. IPC Builds focuses on IPC standards development committee meetings and encourages industry’s contribution to the standards and guidelines that companies and their customers, suppliers, and competitors rely on. Separate registration is required.
For more information on the IPC High Reliability Forum including agenda, speaker profiles, exhibition and sponsorship information, or to register for event, visit www.ipc.org/event/high-reliability-forum.
Suggested Items
GEN3 Announces Exclusive UK Distribution Partnership with RAS for HATS2 Test System
11/19/2024 | Gen3GEN3, a leading British manufacturer of specialised test, measurement & production equipment for the electronics industry, is pleased to announce its partnership with Reliability Assessment Solutions Inc. (RAS), a leader in advanced reliability testing solutions.
DuPont to Feature Innovative Electronics Products and Solutions at Electronica 2024
11/13/2024 | DuPontAs the demand for advanced technology surges, DuPont will be featuring its extensive portfolio of innovative products and solutions at Electronica 2024, the world’s premier trade fair for electronics, November 12-15 in Munich.
Absolute EMS Earns ITAR Registration
10/31/2024 | Absolute EMS, Inc.Absolute EMS, Inc., a six-time award-winning provider of fast turnaround, turnkey contract electronic manufacturing services (EMS), proudly announces its ITAR (International Traffic in Arms Regulations) registration, reinforcing its commitment to serving military, aerospace and defense OEM customers.
Fresh PCB Concepts: The Critical Nature of Copper Thickness on PCBs
10/31/2024 | Team NCAB -- Column: Fresh PCB ConceptsPCBs are the backbone of modern electronics and the copper layers within these boards serve as the primary pathways for electrical signals. When designing and manufacturing PCBs, copper thickness is one of the most critical factors and significantly affects the board’s performance and durability. The IPC-6012F specification, the industry standard for the performance and qualification of rigid PCBs, sets clear guidelines on copper thickness to ensure reliability in different environments and applications.
Spirit Electronics Adds Zero-Error Systems to Provide Ultra-High Reliability Protection from Radiation in Space Applications
10/25/2024 | Spirit ElectronicsSpirit Electronics announces franchised distribution for Zero-Error Systems (ZES) to support ultra-high reliability semiconductors and ICs operating in challenging radiation environments.