The Government Circuit: Three Inescapable Conclusions About Global Trade Policies
Global Citizenship: The Global Push for Digital Inclusion
Knocking Down the Bone Pile: Addressing End-of-life Component Solderability Issues, Part 4
STAr Sagittarius Series Intelligent Integrated Test System
August 12, 2024 | PRNewswireEstimated reading time: 1 minute
STAr Sagittarius Series, launched in 2001, is an intelligent test software designed for semiconductor parametric and reliability test and enables to integrate capacitance-voltage (CV) and current-voltage (IV) measurements into one single platform. As a result of electronics application becomes more diversified, the Sagittarius System has been continuously developed to meet industry measurement needs in the past 20 years, and with more than 3000 copies deployed in foundries, design houses and IDMs at present.
The Sagittarius Series is WindowsTM-based semiconductor parametric test and device characterization test software and integrates seamlessly into most benchtop instruments and probe stations. The software is also a comprehensive tool and accelerates the measurement process. Its graphical configuration and intuitive graphical-based test sequences enable users easily to configure test system with unlimited matrix or multiplexer and test resources such as SMU, CMU by drag-and-drop with just a few clicks.
Moreover, Sagittarius Series Intelligent Test System is under the master-slave operation and controls up to 32 slaves via internet connectivity. All test modes such as control, extra operation steps saving, test setup and test data files are in central management by Master which can view and collect latest update of all Salves system status. With full automation operation for multi-wafer, large statistics sample collection and built-in algorithms/libraries, Sagittarius Series ensures accurate and reliable measurement data for GaN, SiC, MOS, RFICs, RF MOSFET, Silicon Photonics Devices, Si/GaAs ICs, FPD and CMOS, etc.
Share on:
Suggested Items
TRI to Exhibit at SMTA Queretaro Expo 2025
07/16/2025 | TRITest Research, Inc. (TRI), the leading provider of test and inspection systems for the electronics manufacturing industry, is pleased to announce plans to exhibit at the SMTA Querétaro Expo 2025, scheduled to take place on July 24, 2025, at the Querétaro Centro de Congresos y Teatro Metropolitano.
Knocking Down the Bone Pile: Addressing End-of-life Component Solderability Issues, Part 4
07/16/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn 1983, the Department of Defense identified that over 40% of military electronic system failures in the field were electrical, with approximately 50% attributed to poor solder connections. Investigations revealed that plated finishes, typically nickel or tin, were porous and non-intermetallic.
Meet the Author Podcast: Martyn Gaudion Unpacks the Secrets of High-Speed PCB Design
07/16/2025 | I-Connect007In this special Meet the Author episode of the On the Line with… podcast, Nolan Johnson sits down with Martyn Gaudion, signal integrity expert, managing director of Polar Instruments, and three-time author in I-Connect007’s popular The Printed Circuit Designer’s Guide to... series.
TTCI Joins Printed Circuit Engineering Association to Strengthen Design-to-Test Collaboration and Workforce Development
07/09/2025 | The Test Connection Inc.The Test Connection Inc. (TTCI), a leading provider of electronic test and manufacturing solutions, is proud to announce its membership in the Printed Circuit Engineering Association (PCEA), further expanding the company’s efforts to support cross-functional collaboration, industry standards, and technical education in the printed circuit design and manufacturing community.
Study on Resonance Mitigation in Metallic Shielding for Integrated Circuits
07/08/2025 | Maria Cuesta-Martin, Victor Martinez, Vidal Gonzalez Aguado, Würth ElektronikInherent cavity resonant modes often lead to significant degradation of shielding effectiveness, responsible for unwanted electromagnetic coupling. Cavity resonant modes of the metal shielding enclosure can produce two adverse problems: the mutual coupling among different RF modules and shielding effectiveness reduction of the metal enclosure. The cabinets serve to shield certain components from electromagnetic interference (EMI). However, these cavities present some resonance peaks at 5 GHz, making it impossible to use them at higher frequencies.