Solder Printing: A 1:1 Ratio of Technical and Creative
Global Sourcing Spotlight: A World Full of Product Expertise
The Knowledge Base: Enhancing Customer Loyalty and Product QualitySTAr Sagittarius Series Intelligent Integrated Test System
August 12, 2024 | PRNewswireEstimated reading time: 1 minute
STAr Sagittarius Series, launched in 2001, is an intelligent test software designed for semiconductor parametric and reliability test and enables to integrate capacitance-voltage (CV) and current-voltage (IV) measurements into one single platform. As a result of electronics application becomes more diversified, the Sagittarius System has been continuously developed to meet industry measurement needs in the past 20 years, and with more than 3000 copies deployed in foundries, design houses and IDMs at present.
The Sagittarius Series is WindowsTM-based semiconductor parametric test and device characterization test software and integrates seamlessly into most benchtop instruments and probe stations. The software is also a comprehensive tool and accelerates the measurement process. Its graphical configuration and intuitive graphical-based test sequences enable users easily to configure test system with unlimited matrix or multiplexer and test resources such as SMU, CMU by drag-and-drop with just a few clicks.
Moreover, Sagittarius Series Intelligent Test System is under the master-slave operation and controls up to 32 slaves via internet connectivity. All test modes such as control, extra operation steps saving, test setup and test data files are in central management by Master which can view and collect latest update of all Salves system status. With full automation operation for multi-wafer, large statistics sample collection and built-in algorithms/libraries, Sagittarius Series ensures accurate and reliable measurement data for GaN, SiC, MOS, RFICs, RF MOSFET, Silicon Photonics Devices, Si/GaAs ICs, FPD and CMOS, etc.
Share on:
Suggested Items
Zero Defects International to Exhibit at Utah Expo and Tech Forum
09/04/2024 | Zero Defects InternationalZero Defects International [ZDI] has announced their participation as an exhibitor at the SMTA Utah Expo and Tech Forum. It will be held at the Salt Lake City Marriott University Park.
Takaya Exhibiting Flying Probe Test Technology at SMTAI 2024
08/29/2024 | TakayaTEXMAC, the exclusive authorized distributor of Takaya flying probe test systems in North and South America, will be exhibiting highlights of its advanced technology at SMTA International, October 20 - 24, 2024, at the Donald E. Stephens Convention Center in Rosemont, Illinois USA.
Saki to Showcase Cutting-Edge Total Inspection Line Solutions at Productronica India 2024
08/28/2024 | Saki CorporationSaki Corporation, an innovator in the field of automated optical and X-ray inspection equipment, is pleased to announce its participation at productronica India 2024, one of the premier trade events for the electronics manufacturing industry in the region.
Asymmetric Hybrid Printed Circuit Board Design: Warpage Considerations
08/27/2024 | Kaspar Tsang, Gause Hu, Jimmy Hsu, Aje Chang, Alan Sun, Brian Ho, Ryan Chang, and Thonas SuThe printed circuit board (PCB) accounts for a significant portion of the PCBA’s (printed circuit board assembly) BOM (bill of material) cost. Designs with hybrid PCB stackup are adopted to reduce the cost of the PCB by using less expensive laminate materials in layers that do not have routings for high-speed signals (e.g., power and ground layers). The conventional hybrid PCB stackup design is symmetrical in the middle. This engineering technique has been employed in the data center industry for quite some time. To extend the idea and optimize the purpose of hybrid PCB stackup design, the feasibility of an asymmetric hybrid stackup is currently being studied.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
08/16/2024 | Nolan Johnson, I-Connect007People are on the move, new books are being released, and a new PCB manufacturer is making waves. This week, I'm highlighting the latest ASC/Sunstone book on DFM essentials, our 40th book in the I-Connect007 library and a must-read whether you're a new or seasoned member of industry. I'm also including leadership news from NextFlex, a discussion on integrated passives from Joe Fjelstad, and a new processor chip from Intel meant specifically for automotive applications.