Global Sourcing Spotlight: How Global Sourcing Drives Innovation
One World, One Industry: IPC APEX EXPO 2025 Marks a Special Anniversary Year
Nolan’s Notes: Your Golden Ticket
Rogers Announces Departure of Chief Financial Officer
August 13, 2024 | Rogers CorporationEstimated reading time: Less than a minute
Rogers Corporation announced that Ram Mayampurath has resigned as Chief Financial Officer (CFO) to pursue another opportunity. Mayampurath will remain with Rogers through September 2024 to ensure an orderly transition.
Effective August 12, 2024, Laura Russell will assume the role of interim CFO. Ms. Russell joined Rogers in September 2023 as Vice President of Finance and previously served in senior finance roles at Wolfspeed and NXP Semiconductors.
“I want to thank Ram for his leadership and contributions to Rogers over the past 10 years,” said Colin Gouveia, Rogers' President and CEO. “Since taking over as CFO in 2021, Ram has driven key initiatives to improve profitability and cash flow while helping position Rogers for future growth. Ram has been a great business partner and friend, and I wish him success in his future endeavors. I have great confidence in Laura, and we are fortunate to have such an experienced and capable leader serve as interim CFO.”
Rogers has initiated a CFO succession process and will provide updates as appropriate.
Share on:
Suggested Items
Pudu Robotics' PUDU T300 Achieves CE-MD and CE-RED Certifications
03/12/2025 | PRNewswirePudu Robotics, a global leader in service robotics sector, announced its innovative industrial delivery robot, the PUDU T300, has obtained both the CE-MD (Machinery Directive) and CE-RED (Radio Equipment Directive) certificates by TÜV SÜD, a world-renowned testing and certification organization.
TI Introduces the World's Smallest MCU, Enabling Innovation in the Tiniest of Applications
03/12/2025 | PRNewswireTexas Instruments (TI) introduced the world's smallest MCU, expanding its comprehensive Arm® Cortex®-M0+ MSPM0 MCU portfolio. Measuring only 1.38mm2, about the size of a black pepper flake, the wafer chip-scale package (WCSP) for the MSPM0C1104 MCU enables designers to optimize board space in applications such as medical wearables and personal electronics, without compromising performance.
indie Semiconductor and GlobalFoundries Announce Strategic Collaboration to Accelerate Automotive Radar Adoption
03/12/2025 | GlobalFoundriesindie Semiconductor, an automotive solutions innovator, has announced a strategic collaboration with GlobalFoundries (Nasdaq: GFS) (GF) to develop its portfolio of high-performance radar systems-on-chip (SoC).
Siemens Extends PAVE360 Technology to AMD GPUs Running on Microsoft Azure Cloud
03/11/2025 | SiemensSiemens Digital Industries Software announced that it has expanded the cloud platforms of choice available for systems-of-systems development with its PAVE360™ technology for Software Defined Vehicle (SDV) development which is now available on AMD Radeon™ PRO V710 GPUs and AMD EPYC™ CPUs running on Azure, Microsoft’s cloud and AI platform.
Apple’s Year-End Production Peak and China’s Subsidy Policies Drive 9.2% QoQ Growth in 4Q24 Smartphone Production
03/11/2025 | TrendForceTrendForce reports that global smartphone production in the last quarter of 2024 reached 334.5 million units, reflecting a 9.2% QoQ increase, driven by Apple’s peak production season and consumer subsidies from local Chinese governments.