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August 14, 2024 | Rehm Thermal SystemsEstimated reading time: 1 minute
Bondexpo, one of the most important international trade fairs for industrial bonding technologies, is opening its doors in Stuttgart for the 17th time: from 8 to 11 October, numerous exhibitors will be presenting their detail and system solutions for joining and connecting components and assemblies in pre-assembly and final assembly – Rehm Thermal Systems will also be there with its dispensing and conformal coating system!
In Hall 5 at Booth 5411, the Rehm experts will inform you about the wide range of applications of the ProtectoXP as well as the new integrated 3D height sensor of this dispensing and coating system and will be happy to answer all your questions.
The system impresses with its process reliability, solid mechanical engineering and versatile applicators, which allow the user a wide range of possible applications: in addition to dispensing, the ProtectoX series amazes with the ability to create freely defined three-dimensional enclosure shapes through simple application. Immediate curing of UV coatings is possible with ProtectoX systems as well as moulding or bonding of different materials.
The series operates through the intuitive ViCON Protecto software, which is particularly user-friendly thanks to a newly developed touchscreen interface. It features numerous software capabilities, including the ability to directly import eCAD data and image files for optimizing the coating process through trimming. Furthermore, coating programmes can be created directly on the machine or at an offline workstation.
We look forward to your visit and the opportunity to discuss the individual challenges of your manufacturing or production with you in person: we will find the right solution for you – in keeping with the tradition of the state of inventors and tinkerers!
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