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Testimonial

"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."

Julia McCaffrey - NCAB Group

Suggested Items

From Aspiration to Acceleration: How IEMI Reflects India’s Electronics Growth

02/17/2026 | Sanjay Huprikar, Chief Global Officer, Global Electronics Association
In 2022, the Global Electronics Association’s team in India launched Integrated Electronics Manufacturing & Interconnections (IEMI) as a humble yet aspirational vision for India to become a vital community connector between global supply chains and regional electronics manufacturing ecosystems. Fast forward to January 2026, and a lot has certainly happened in the macro-sense within four lightning quick years. Against this immense backdrop of progress, the fourth edition of IEMI, held in Bangalore on Jan. 29–30, was attended by 1,600 delegates, including 100 from 15 countries outside India representing Asia, Europe, Africa, North America, and Australia. 

EIPC Winter Conference Review: From Innovation to Qualification

02/13/2026 | Pete Starkey, I-Connect007
Refreshed after a reasonably early night and a restful sleep, delegates dutifully re-assembled for Day 2 and Session 4 of EIPC’s Winter Conference in Aix-en-Provence on Feb. 4, “Driving the Future: Innovation, Energy, and Sustainability in PCB Technology.” The theme of this session, moderated by EIPC board member Martyn Gaudion, CEO of Polar Instruments, was “From innovation to qualification: New materials, processes and applications.” His first speaker was Steve Driver, whose presentation was entitled “Ideation > Certification > Qualification > Integration” and subtitled “The journey of a disruptor.”

EIPC Winter Conference Review: A Focus on Miniaturization

02/12/2026 | Pete Starkey, I-Connect007
The theme of the first technical session of EIPC’s Winter Conference in Aix-en-Provence on Feb. 3 was “Miniaturisation and fine-line PCB production: From design to manufacturing.” The session was moderated by EIPC Vice President Thomas Michels, CEO of ILFA in Germany. The theme of the conference is “Driving the Future: Innovation, Energy, and Sustainability in PCB Technology.” The opening presentation came from applications engineering specialist Dr. Roland Steim of Dyconex in Switzerland, who described how the company has addressed the challenges of miniaturisation and fine-line PCB production.

Survey Says: Avnet's Insights Into How Engineers Are Adopting AI

02/09/2026 | Nolan Johnson, I-Connect007
Avnet regularly surveys engineers to learn what they’re thinking. That sort of information is quite important to Alex Iuorio, vice president of supplier development at Avnet. In this interview, Alex talks about what he’s learned from the most recent survey and its implications to the supply market in 2026 and beyond. No surprise, AI plays a remarkably large role in all the current trends.

The Right Approach: Reflections on 50 Years in the Business, Part 1

02/10/2026 | Steve Williams -- Column: The Right Approach
Last September and October, I wrote a two-part column, "Electro-Tek: A Williams Family Legacy Part 1" and "Electro-Tek: A Williams Family Legacy Part 2," which prompted me to reflect on the changes I have witnessed over the past 50 years in the PCB and broader electronics industry. The prior articles focused on the family business and my dad, so a follow-up on my journey is a logical next step. In this new three part series, I will be looking back as 2026 marks my 50th year in the business, beginning with the first 22 years of my career manufacturing PCBs.
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