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WELLER Highlights IPC Class and CTI for Reliable PCB Manufacturing

09/24/2026 | ACCESSWIRE
WELLER PCB is highlighting the importance of defining IPC manufacturing class and PCB laminate requirements before a project enters production, especially for industrial, high-voltage and reliability-sensitive electronics.

ASC Sunstone Circuits to Exhibit and Present Lunch-and-Learn at PCB West 2026

09/21/2026 | ASC Sunstone Circuits
ASC Sunstone Circuits will exhibit at PCB West 2026, taking place September 29 through October 2 at the Santa Clara Convention Center in Santa Clara, California. The PCB West exhibition will be held Wednesday, September 30.

ITAR vs. EAR: When PCB Fabrication Can Move Outside the U.S.

08/31/2026 | Ryan O'Connor, SOMACIS
The difference between ITAR and EAR is often reduced to a simple rule of thumb: ITAR programs must stay in the U.S. (exceptions apply), while EAR programs can be built anywhere. In practice, that distinction is incomplete and often leads to sourcing decisions that introduce compliance risk rather than reducing it. Whether a PCB can be fabricated outside the United States depends not just on whether it is ITAR- or EAR-controlled, but on how the program is classified, what data is involved, who can access it, and how fabrication is executed across locations.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

08/28/2026 | Nolan Johnson, I-Connect007
This week, the Global Electronics Association published its monthly report on PCB fabrication and EMS bookings and shipments, and the numbers are extremely positive. In EMS, the three-month book-to-bill ratio stands at 1.29 for July. Year-to-date EMS bookings are at 11% over 2025. The picture is similar in PCB fabrication as well. Year-to-date bookings are up 33% over last year, and book-to-bill stands at 1.46.

VeCS HDI Process Technology: Has the Time Come for Broader Adoption?

08/25/2026 | Joan Tourné, NextGin Technology
Packaging technology has always driven the PCB, but today's AI and high-performance computing devices are accelerating that relationship. As compute density, bandwidth, and power requirements increase, package, substrate, and PCB design become more interdependent. Modern AI processors, such as NVIDIA's Blackwell architecture, require thousands of package connections, support multiple stacks of high-bandwidth memory (HBM), and can dissipate as much as 1,000 watts of power or more. These demands are driving new approaches to package substrates, redistribution layers (RDLs), thermal management, and PCB fabrication, where manufacturing itself is becoming a limiting factor.
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