-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueTechnology Roadmaps
In this issue of PCB007 Magazine, we discuss technology roadmaps and what they mean for our businesses, providing context to the all-important question: What is my company’s technology roadmap?
Wet Process Control
In this issue, we examine wet processes and how to obtain a better degree of control that allows usable data to guide our decisions and produce consistently higher-quality products.
Don’t Just Survive, Thrive
If we are to be relevant and prosper during these next critical decades in electronics, we must do more than survive. As an industry, we can and must thrive. In this issue, our contributors explore these concepts meant to help you take your business to the next level.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - pcb007 Magazine
PCB007 Magazine August 2024: Advancing Wet Process Control
August 15, 2024 | IPC Community Editorial TeamEstimated reading time: Less than a minute
By and large, the overarching truths of process control and quality management are immutable. Whether Deming, Lean or Six Sigma, precision process control is becoming more important as technology advances and environmental considerations loom large.
Nowhere is this more true than in the wet process area of PCB fabrication. Long experienced to be dirty, smelly and somewhat unsafe, that is no longer the case. But are we where we should be when it comes to control over our wet processes?
In the August 2024 issue of PCB007 Magazine we asked wet process experts Mike Carano, Mike Brask, Happy Holden, and Don Ball to share their wisdom.
Suggested Items
Precise PCB Structuring with LPKF ProtoMats and ProtoLasers
09/16/2024 | LPKFRF circuits have a firm place in technical applications. They require precise geometric layouts to achieve reliable results. LPKF will be showing how these can be manufactured in your own laboratory at booth 325C on the European Microwave Week 2024 from September 24 to 26 in Paris.
Book Excerpt: The Printed Circuit Assembler’s Guide to... Factory Analytics, Chapter 4
09/11/2024 | I-Connect007 Editorial TeamIn this chapter, readers will learn the importance of efficiency in post-SMT processes such as rework and testing. Key KPIs are discussed, along with the need to reduce rework time, improve first-pass yield, maintain testers, and monitor defect rates. By optimizing these processes, manufacturers can enhance product quality, reduce costs associated with defects, and ensure customer satisfaction.
Beyond Design: Integrated Circuit to PCB Integration
09/11/2024 | Barry Olney -- Column: Beyond DesignTechnologies such as artificial intelligence, autonomous cars, smartphones, and wearable devices are significantly transforming the semiconductor industry. The miniaturization trend drives the IC footprint to an even smaller profile, requiring tighter margins. From the PCB designer’s perspective, smaller form factors are achievable, making devices more compact and lightweight. But double-sided SMT placement, reduced routing channels, and high-speed constraints create multiple challenges for designers. However, there are some advantages to miniaturization: shorter interconnects between the IC and the PCB reduce signal loss and electromagnetic interference. High-speed digital signals in the GHz range benefit from reduced parasitics.
Trouble in Your Tank: Things You Can Do for Better Wet Process Control
09/11/2024 | Michael Carano -- Column: Trouble in Your TankFor 40 years, I have been involved in the printed circuit board, circuit board assembly, and semiconductor technology segments, preaching about minimizing defects and improving yields. This is especially true as technology becomes increasingly complex, and additional focus must be placed on yield improvements. Process management and wet process control must be front and center, so it’s quite interesting and timely to talk about wet process control and management for this month’s issue. This theme fits quite well with today's global events. For this industry, the technical curve has steepened dramatically in the past few years.
Sondrel Announces Advanced Modelling Process for AI Chip Designs
09/10/2024 | SondrelSondrel, a leading provider of ultra-complex custom chips for leading global technology brands, has announced an Advanced Modelling Process for AI chip designs.