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Current IssueAdvanced Packaging and Stackup Design
This month, our expert contributors discuss the impact of advanced packaging on stackup design—from SI and DFM challenges through the variety of material tradeoffs that designers must contend with in HDI and UHDI.
Rules of Thumb
This month, we delve into rules of thumb—which ones work, which ones should be avoided. Rules of thumb are everywhere, but there may be hundreds of rules of thumb for PCB design. How do we separate the wheat from the chaff, so to speak?
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Our expert contributors provide a complete, detailed view of partial HDI this month. Most experienced PCB designers can start using this approach right away, but you need to know these tips, tricks and techniques first.
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Moving from Surviving to Thriving
August 19, 2024 | Mark Wolfe, IPCEstimated reading time: 1 minute
A few months ago, I shared some thoughts regarding the implications of the survival mode that most of us have lived in, at least for the past several years, within the electronics supply chain. In this article, I would like to share some additional thoughts about how companies can move away from merely surviving and work toward thriving across their supply chain. At a high level, here is what I believe the foundation of thriving looks like:
It is centered around open, honest, and transparent communication.
- All parties should work to understand the other’s perspectives first.
- You should always try to assume that intentions are good even when it doesn’t feel that way.
- Bad news is shared just as quickly as good news in both directions.
- When suppliers don’t “win” (short term opportunities), help them understand why not.
- It should also involve long-term perspectives.
- When mistakes happen, work to focus on “what happened?” not “who did it?”
- Try to learn from mistakes and determine how to eliminate them in the longer term.
- Commit energy to long-term strategic conversations with your key suppliers.
Commit to and trust that all parties want everyone to win (over the long term).
To read this entire article, which appeared in the August 2024 issue of SMT007 Magazine, click here.
Suggested Items
UHDI Fundamentals: UHDI Bleeding-edge Manufacturing Applications, Part 2
12/23/2024 | Anaya Vardya, American Standard CircuitsUltra high-density interconnect (UHDI) technology is transforming manufacturing by enabling compact, high-performance, and energy-efficient electronics in cutting-edge industrial systems. Its precision and scalability meet the demands of advanced manufacturing technologies. Here's another overview of bleeding-edge UHDI applications in manufacturing.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
12/20/2024 | Nolan Johnson, I-Connect007Hey, wait a minute, this is the lead-up to the penultimate holiday week, so why is the news cycle so busy? Normally, this period of time—what with all the holiday distraction—is when companies either go quiet or publish press releases covering those throwaway news items. Instead, this week brought in so much important news that I had to be quite discerning in my choices. Newsletter subscribers definitely got a lot of news this week.
Indium Technical Expert to Present at SiP Conference China
11/25/2024 | Indium CorporationIndium Corporation Senior Area Technical Manager for East China Leo Hu is scheduled to deliver a presentation on Low-Temperature Solder Material in Semiconductor Packaging Applications at SiP China Conference 2024 on November 27 in Suzhou, China.
Offshore Sourcing in the Global Supply Chain
11/20/2024 | Brittany Martin, I-Connect007Bob Duke, president of the Global Sourcing Division at American Standard Circuits, discusses the challenges and benefits of navigating the global supply chain, including the value of strong supplier relationships, rigorous quality control, and strategic sourcing from regions including China, Vietnam, and India.
Advanced Packaging: Preparation is Now
11/20/2024 | Nolan Johnson, SMT007 MagazineA new IPC white paper, “Advanced Packaging to Board Level Integration—Needs and Challenges,” authored by Devan Iyer, chief strategist of advanced packaging, and Matt Kelly, chief technology officer, shares expertise on and advocacy for advanced packaging. In this conversation, they share details from the paper about the complexities of advanced packaging technology and provide additional insight into how next-generation packaging will change how printed circuit boards will be designed, fabricated, and assembled, including final system assembly implications.