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Book Excerpt: The Printed Circuit Assembler’s Guide to... Factory Analytics, Chapter 4

09/11/2024 | I-Connect007 Editorial Team
In this chapter, readers will learn the importance of efficiency in post-SMT processes such as rework and testing. Key KPIs are discussed, along with the need to reduce rework time, improve first-pass yield, maintain testers, and monitor defect rates. By optimizing these processes, manufacturers can enhance product quality, reduce costs associated with defects, and ensure customer satisfaction.

Beyond Design: Integrated Circuit to PCB Integration

09/11/2024 | Barry Olney -- Column: Beyond Design
Technologies such as artificial intelligence, autonomous cars, smartphones, and wearable devices are significantly transforming the semiconductor industry. The miniaturization trend drives the IC footprint to an even smaller profile, requiring tighter margins. From the PCB designer’s perspective, smaller form factors are achievable, making devices more compact and lightweight. But double-sided SMT placement, reduced routing channels, and high-speed constraints create multiple challenges for designers. However, there are some advantages to miniaturization: shorter interconnects between the IC and the PCB reduce signal loss and electromagnetic interference. High-speed digital signals in the GHz range benefit from reduced parasitics.

Trouble in Your Tank: Things You Can Do for Better Wet Process Control

09/11/2024 | Michael Carano -- Column: Trouble in Your Tank
For 40 years, I have been involved in the printed circuit board, circuit board assembly, and semiconductor technology segments, preaching about minimizing defects and improving yields. This is especially true as technology becomes increasingly complex, and additional focus must be placed on yield improvements. Process management and wet process control must be front and center, so it’s quite interesting and timely to talk about wet process control and management for this month’s issue. This theme fits quite well with today's global events. For this industry, the technical curve has steepened dramatically in the past few years.

Sondrel Announces Advanced Modelling Process for AI Chip Designs

09/10/2024 | Sondrel
Sondrel, a leading provider of ultra-complex custom chips for leading global technology brands, has announced an Advanced Modelling Process for AI chip designs.

PCB Workshop and Plant Tour Hosted by the SMTA Wisconsin Chapter

09/09/2024 | SMTA
This half-day course will provide participants with a comprehensive understanding of the multi-layer PCB fabrication process. The workshop will explore how PCB design influences fabrication steps and how the finished product integrates into the assembly process.
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