Fresh PCB Concepts: Traceability in PCB Design
The Shaughnessy Report: Back to the Future
Designers Notebook: Addressing Future Challenges for Designers
Cost-optimize Your PCB Design and Specifications
August 20, 2024 | Erik Pedersen and Richard Koensgen, ICAPE GroupEstimated reading time: 1 minute
Knowledge is the key to identifying the small details that makes the big cost difference for your printed circuit board. There are many types of printed circuit boards and multiple choices between the development of schematic and BOM to PCB technology selection, electronic PCB design, mechanical and physical properties, and PCB specification.
Component Technology and BGA Size
The component size and technology have the most significant influence on the PCB cost. Most surface-mounted microchips can be designed into standard PCBs with plated through-holes. If the same microchip comes in a BGA package, it might need microvias and buried vias using a higher wiring density to be designed into an HDI PCB. Generally, PCBs containing BGAs become HDI PCBs when the ball center-to-center pitch is below 0.8 mm. If your physical board properties allow it and the component availability is equal, you should strive to find the BGA with the largest pitch to reduce the component and PCB cost.
For example, the same BGA microchip can be found with pitch 0.8 mm, 0.6 mm, and 0.5 mm. The 0.8 mm pitch BGA can be routed on an eight-layer standard PCB with a price index of 100. The 0.6 mm pitch can be routed on a (1-6-1) eight-layer, one-step HDI PCB with a price index of 200. The 0.5 mm pitch BGA can be routed on a (2-4B-2) eight-layer, three-step HDI PCB with a price index of 350. The number of lamination steps is the most significant cost driver for HDI and ultra HDI PCBs. Designs with BGAs equal to or less than 0.4 mm and multiple rows challenge the capability of HDI suppliers, which leads to the use of UHDI design parameters and thereby reduces the availability and increases the cost.
Material Selection
Correct material selection that complies with the performance and functionality of your application also plays a crucial role in the PCB cost.
The most common stackups of standard PCBs are specified with 35 µm Cu on all layers. The manufacturer starts on 17.5 µm Cu on outer layers and 35 µm Cu on inner layers, since the final outer layer Cu thickness reaches approximately 35 µm after plating. But 35 µm Cu on the inner layers isn’t always required and can be replaced by 17.5 µm for the current flowing in many electronic devices. This, in turn, lowers costs.
To continue reading this article, which originally published in the August 2024 Design007 Magazine, click here.
Share on:
Suggested Items
Summit Interconnect Welcomes Leo LaCroix as Vice President of Aerospace & Defense Operations
02/21/2025 | Summit Interconnect, Inc.Summit Interconnect, a leading provider of advanced printed circuit board (PCB) solutions, is pleased to announce that Leo LaCroix has joined the company as Vice President of Aerospace & Defense Operations. In this role, LaCroix will oversee operational strategy, customer engagement, and manufacturing excellence for Summit’s aerospace and defense-focused facilities, driving continued growth and innovation in the sector.
North American PCB Industry Sales Up 19.9% in January
02/20/2025 | IPCIPC announced today the January 2025 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 1.24.
The Resurgence of European PCB Manufacturing: A Strategic Advantage
02/20/2025 | Jordan Labbe, ICAPE GroupThe global electronics landscape is undergoing a significant transformation. Driven by a confluence of factors, including geopolitical instability, supply chain disruptions, and a growing emphasis on agility and localized production, a renewed focus on European PCB manufacturing is emerging. This resurgence is not merely a trend; it represents a strategic advantage for companies seeking to navigate the complexities of the modern electronics market with multiple sourcing options, outside of China.
Are Domestic Assemblers Ready for the Next Level of Electronics Miniaturization?
02/19/2025 | Chrys Shea, SHEA Engineering ServicesUHDI technology is more than another evolutionary level of miniaturization. It’s a fundamental change in how we create circuit boards, on a scale potentially as impactful as the transition from through-hole to surface mount was 40 years ago.
EIPC 2025 Winter Conference, Day 1: From Manufacturing to Sustainability
02/19/2025 | Pete Starkey, I-Connect007The EIPC 2025 Winter Conference, Feb. 4-5, in Luxembourg City, featured keynotes and two days conference proceedings. This is my report of the first day’s conference proceedings. The keynote session and second-day conference proceedings are reported separately.