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From Silos to Systems: 2026 and Beyond
Welcome to the debut issue of I-Connect007 Magazine. This publication brings all of the pieces together from PCB design and fabrication for a closer alignment and a more integrated electronics manufacturing landscape.
Designing Proper Work-Life Balance
In this issue, we hear from designers, marketers, and business owners on how they apply their professional skills to their personal lives to build a healthier work-life balance.
Designing Proper Planes
Without planes, designers would have to create thousands of traces to accomplish the same objectives. Power planes provide low impedance and stable power, and ground planes stabilize reference voltage, improve thermal performance, and help preclude EMI issues.
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Polar Instruments Announces Additive Transmission Line Support for Si9000e
August 20, 2025 | Polar InstrumentsEstimated reading time: 1 minute
Transmission lines embedded into the PCB surface are a feature of UHDI constructions. The 2025 fall release of Polar's Si9000e PCB impedance & insertion loss transmission line field solver incorporates eight new single ended, differential and coplanar transmission line structures. With well in excess of 100 commonly used PCB transmission line structures the Si9000e allows designers, PCB technologists and PCB fabricators not only to solve for impedance or insertion loss, but also makes light work of exploring design space with a variety of tools for sensitivity analysis and the option to run Monte-Carlo simulations.
In addition to modeling loss and impedance, the Si9000e is capable of taking account of surface roughness effects and offers several industry standard methods for estimating the effects of surface profiles. Other useful features include a traffic signal warning for vias that require stub reduction by backdrilling, and the ability to estimate crosstalk. A further option extends crosstalk modelling to the coupling between differential pairs. Last but not least an alternative to 3d modeling of differential vias is included based on models provided by Bert Simonovich of Lamsim Enterprises.
Evaluation licenses are available and Si9000e may be commercially licensed from single user through to enterprise levels.
Contact Erik Bateham at Polar Instruments for more information.
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Julia McCaffrey - NCAB GroupSuggested Items
UHDI Fundamentals—Foundations and Drivers of the PCB Flex: Advanced Packaging Nexus, Part 1
02/16/2026 | Anaya Vardya, American Standard CircuitsThe electronics industry is undergoing a fundamental transformation driven by demands for smaller form factors, higher performance, and greater functional integration. Two technologies sit at the center of this transformation: flexible PCBs and advanced semiconductor packaging. In this article, I’ll explore the technical foundations and key forces driving this convergence. Flexible PCBs are electrical interconnects fabricated on bendable substrates such as polyimide or polyester. Unlike rigid PCBs, flex circuits can conform to three-dimensional shapes, enabling designers to route signals through space rather than across flat planes
NCAB Group Reports Strong Q4 and Year-End 2025 Results with Robust Sales and Order Growth
02/13/2026 | NCABNCAB Group released its Q4 and full-year 2025 results, reporting strong year-end momentum with double-digit growth in net sales and order intake, and a solid book-to-bill ratio of 1.21.
ICAPE: Consolidated Annual Revenue 2025
02/13/2026 | BUSINESS WIREAnnual revenue growth of +11.5% for ICAPE in 2025 to €202.7 million and organic growth excluding currency effects of +5.1%
EIPC Winter Conference Review: From Innovation to Qualification
02/13/2026 | Pete Starkey, I-Connect007Refreshed after a reasonably early night and a restful sleep, delegates dutifully re-assembled for Day 2 and Session 4 of EIPC’s Winter Conference in Aix-en-Provence on Feb. 4, “Driving the Future: Innovation, Energy, and Sustainability in PCB Technology.” The theme of this session, moderated by EIPC board member Martyn Gaudion, CEO of Polar Instruments, was “From innovation to qualification: New materials, processes and applications.” His first speaker was Steve Driver, whose presentation was entitled “Ideation > Certification > Qualification > Integration” and subtitled “The journey of a disruptor.”
High-Tech Hill in Lithuania: Europe’s PCB Comeback
02/12/2026 | Marcy LaRont, I-Connect007 MagazineTLT Manufacturing, part of the Teltonika group, is assembling something Europe hasn’t seen in decades: a fully integrated electronics manufacturing hub in Vilnius, Lithuania. Last September, TLT officially opened High-Tech Hill, its new technology campus, simultaneously launching four facilities: two EMS plants, a large greenfield PCB fabrication plant, and a plastic injection molding operation. This move brings design, tooling, production, and full manufacturing services under one roof.