Dan's Biz Bookshelf: 'Apple in China: The Capture of the World’s Greatest Company'
The Chemical Connection: Experience and Wisdom Gained by Doing Business
It's Only Common Sense: Leveraging AI in Your Sales Strategy
Semiconductor Industry Experts to Present Solutions to Boost Performance at Advanced Packaging Summit in Korea
August 21, 2024 | SEMIEstimated reading time: Less than a minute
With innovations in advanced packaging crucial to enhancing semiconductors for AI, high-performance computing (HPC) and other leading-edge applications, the Advanced Packaging Summit 2024 will gather industry visionaries on September 11 at the Suwon Convention Center to present packaging technology roadmaps and discuss solutions to performance challenges.
Organized by SEMI Korea, Advanced Packaging Summit 2024 will bring together leaders from companies such as Intel, Samsung, and SK hynix to explore topics including 2.5D packaging, chiplet packaging, co-packaged optics (CPO) and flip-chip ball grid array (FCBGA) substrate technologies. The Summit will feature a panel discussion that will examine how advanced packaging can help meet the performance demands of AI and HPC.
Agenda Topics and Presenters
- The Journey of the Semiconductor Industry and the Innovation of Advanced Packaging - Heejoung Joun, Samsung Electronics
- CPO (Co-Packaged Optics) - David Harame, AIM Photonics
- Advanced Packaging Technology for HBM and 2.5D SiP - Ho-Young Son, SK hynix
- Enabling the AI Era - Jinyoung Jeon, ASMPT
- The Role of Advanced Packaging Technology for AI - SungSoon Park, Intel
- FCBGA Substrate Technologies for AI/HPC - Mooseong Kim, LG Innotek
- Advanced Packages for Chiplets - TaeKyeong Hwang, Amkor Technology Korea
- Glass Substrates - Prof. Bongyoung Yoo, Hanyang University
Share on:
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Defense Speak Interpreted: If CHIPS Cuts Back, What Happens to Electronics Packaging Funds?
09/02/2025 | Dennis Fritz -- Column: Defense Speak InterpretedIn my May column, I examined the topic of the CHIPS Act and its current status as a U.S. government program. I found that CHIPS activities continue, but some corporations have delayed or canceled them because of budget cuts or corporation-specific problems. However, CHIPS integrated circuits—mostly administered by the Department of Commerce—don’t fully drive the electronics interconnection activity being funded by the government. Let’s cover the progress/status of other programs:
Amkor Announces New Site for U.S. Semiconductor Advanced Packaging and Test Facility
09/01/2025 | BUSINESS WIREAmkor Technology, Inc., a leading provider of semiconductor packaging and test services, announced revised plans for the location of the company’s new semiconductor advanced packaging and test facility in Arizona.
Koh Young Hosts First Technical Review Meeting at New Taiwan Office to Showcase Advanced Metrology and Inspection Solutions
09/01/2025 | Koh YoungKoh Young Technology, the global leader in True 3D measurement-based inspection and metrology solutions, is inviting semiconductor and SMT professionals to its first Technical Review Meeting at the newly opened Koh Young Taiwan (KYTW) office in Zhubei City.
Amkor Technology Issues Statement Regarding City of Peoria Land Acquisition
08/28/2025 | Amkor TechnologyAmkor Technology, Inc., a leading provider of semiconductor packaging and test services, today announced the City of Peoria, Arizona successfully bid as part of a State Land Auction to acquire 834.5 acres for future development.
Coming Soon: The Advanced Electronics Packaging Digest
08/27/2025 | Marcy LaRont, I-Connect007The upcoming Advanced Electronics Packaging Digest is a curated, condensed monthly publication designed to keep you informed and engaged with the fast-moving world of advanced electronics packaging (AEP). In our inaugural September issue, we will begin at the foundation with an in-depth interview featuring Matt Kelly, CTO of the Global Electronics Association. Kelly and his Technology Solutions Team approach advanced packaging from a holistic systems perspective.