-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueTechnology Roadmaps
In this issue of PCB007 Magazine, we discuss technology roadmaps and what they mean for our businesses, providing context to the all-important question: What is my company’s technology roadmap?
Wet Process Control
In this issue, we examine wet processes and how to obtain a better degree of control that allows usable data to guide our decisions and produce consistently higher-quality products.
Don’t Just Survive, Thrive
If we are to be relevant and prosper during these next critical decades in electronics, we must do more than survive. As an industry, we can and must thrive. In this issue, our contributors explore these concepts meant to help you take your business to the next level.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - pcb007 Magazine
Smartkem to Present at The International Conference on Flexible and Printed Electronics (ICFPE) 2024
August 21, 2024 | BUSINESS WIREEstimated reading time: Less than a minute
Smartkem, a company that has the potential to power the next generation of displays using its disruptive organic thin-film transistors (OTFTs), announced that it will be giving a live in-person presentation titled "Developing Flexible Integrated Circuits Through Customized Organic TFTs" at The International Conference on Flexible and Printed Electronics (ICFPE) 2024 at 2:40 PM (local time) on Wednesday, August 28, 2024.
- Presentation Date: Wednesday, August 28th, 2024
- Time: 14:40-15:00 local time
- Title: Developing Flexible Integrated Circuits Through Customized Organic TFTs
- Location: GIS Convention Center, National Taiwan University, Taipei, Taiwan
The presentation, given by Smartkem Head of Technology Transfer, Steven Tsai, will take place during a session titled "Flexible and Printed Electronics: New Technologies and Applications", moderated by Dr. Klaus Hecker, Managing Director at OE-A. Smartkem representatives will be in attendance throughout the conference, from Tuesday, August 28 to Friday, August 30, and will be available for 1-on-1 meetings.
Suggested Items
nano3Dprint Unveils Cutting-Edge Conductive Silver Ink Products in Collaboration with Creative Materials
08/27/2024 | PRWEBnano3Dprint, a leading additive manufacturing and printed electronics solutions provider, is thrilled to announce the launch of its groundbreaking Conductive Silver Ink Products for use in nano3Dprint's A2200, B3300 and MatDep Pro 3D printers.
Global Flexible PCB Market Rebounds in 2024, Driven by New Device Demand and Electric Vehicles
08/16/2024 | TPCATaiwan Printed Circuit Association (TPCA) and the Industrial Technology Research Institute (ITRI) recently released the "2024 Global Flexible PCB Industry Overview and Development Trends" report. It forecasts that the global flexible PCB market will gradually recover from the downturn in 2023, with the market size (including rigid-flex PCBs, the same below) expected to reach USD 19.7 billion in 2024, representing a 7.3% year-on-year growth.
All Flex Solutions Adds Talent to Flexible Circuit Assembly
08/14/2024 | All Flex SolutionsThe Flexible Circuit Assembly Center of Excellence at All Flex Solutions is pleased to announce a key hire and a promotion in their operation in Bloomington, Minnesota.
DuPont Acquires Nanowire Technology and Business Assets from C3Nano
08/14/2024 | DuPontThis acquisition expands DuPont's electronics materials offerings and adds capabilities to provide cutting-edge technological solutions for transparent and flexible films and inks.
SEMI FlexTech Announces 2024 FLEXI Award Winners for Outstanding Achievements in Flexible Electronics
08/05/2024 | SEMIRecognizing innovations and other outstanding accomplishments in flexible hybrid electronics (FHE), FlexTech , a SEMI Technology Community, announced winners of the 2024 FLEXI Awards presented at the FLEX Conference on July 10 at the Moscone Center in San Francisco.