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ESMC Breaks Ground on Dresden Fab

08/20/2024 | TSMC
ESMC – a joint venture between TSMC, Robert Bosch GmbH, Infineon Technologies AG and NXP Semiconductors N.V. –held a groundbreaking ceremony to officially mark the initial phase of land preparation for its first semiconductor fab in Dresden, Germany.

Merlin Flex Invests in New Techwin Solder Mask Developer

05/31/2024 | Merlin Flex Ltd
Merlin Flex Continue their investment programme with the installation & commissioning of a new Techwin Solder Mask Developer. This new machine allows faster & more accurate developing in the solder mask process.

Trouble in Your Tank: Processes to Support IC Substrates and Advanced Packaging, Part 3

08/11/2023 | Michael Carano -- Column: Trouble in Your Tank
In two previous columns, I explored several of the key competencies and processes required to successfully jump into IC substrates. In this edition, the key process of desmear will be explored. These processing steps require additional improvements over normal through-holes due to small diameter through-holes and blind vias. Getting process chemistries down into these small holes can be very difficult, especially if they have any trapped air bubbles.

Koh Young’s Axel Lindloff to Speak on AI-powered Process Optimization at eSmart Factory Conference

04/11/2023 | Koh Young
Koh Young, the industry leader in True3D measurement-based inspection solutions, will be speaking at the eSmart Factory conference 2023 held all day at the Sheraton Carlton Hotel in Nürnberg, Germany the day before SMTconnect.

SAS Joins CESMII to Accelerate the Adoption of Analytics, AI

02/08/2023 | Business Wire
More and more top manufacturers use artificial intelligence (AI), machine learning and streaming analytics from SAS, the leader in analytics, to transform operations and better serve customers.
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