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Pre-registration Now Open for NEPCON ASIA 2024: Experience the Future of Electronics Manufacturing
August 23, 2024 | PRNewswireEstimated reading time: 2 minutes
NEPCON ASIA 2024, one of the most influential events in electronics manufacturing, organized by RX Shenzhen, will take place from November 6-8, 2024, at the Shenzhen World Exhibition & Convention Center (Bao'an). The event will feature over 600 top exhibitors from around the globe, showcasing cutting-edge technologies in circuit board assembly, semiconductor packaging, automation, and smart factory solutions. This annual gathering is a must-attend for industry professionals looking to reduce costs, optimize supply chains, and explore the latest innovations in the Asian electronics manufacturing sector.
Optimizing the Electronics Manufacturing Ecosystem
As new technologies like 5G, IoT, and AI continue to evolve, the electronics manufacturing industry is rapidly expanding across sectors such as consumer electronics, intelligent manufacturing, and new energy vehicles. NEPCON ASIA 2024 will feature leading companies presenting a wide range of solutions, from surface mounting and testing to automation and electronics materials. This one-stop event offers direct access to global suppliers, helping businesses enhance efficiency and stay ahead of the competition.
Spotlight on Power Semiconductor Packaging and Testing
The booming markets of new energy vehicles, smart grids, and third-generation semiconductors are driving the growth of the power semiconductor sector. NEPCON ASIA 2024 will showcase the latest advancements in this field with a dedicated area featuring new IGBT and SiC module packaging and testing production lines. Over 60 brands will present their cutting-edge equipment and materials, offering visitors a unique opportunity to optimize their production processes.
Introducing NEPCON ∞ SPACE in South China
As the global automotive electronics market is set to surpass USD350 billion by 2025, NEPCON ASIA is launching NEPCON ∞ SPACE in South China. This new feature will highlight automotive electronics through disassembly displays, technology salons, and immersive experiences. Industry experts will be on hand to share insights, making it an essential stop for those in automotive electronics.
Fostering Global Collaboration
China's electronics manufacturing industry continues to grow, driven by a strong PCBA production capacity and a comprehensive industrial chain. NEPCON ASIA 2024 will host a range of international activities, including business exchanges, matchmaking sessions, and factory visits, designed to promote cross-border collaboration and trade. The event will also feature a China Manufacturing PCBA and Smart Factory Technology Seminar, offering overseas buyers insights into China's innovative solutions.
Engage with Industry Leaders at Over 40 Forums & Events
NEPCON ASIA 2024 will host forums across five key segments: Electronics Manufacturing, Smart Factory & Automation, Semiconductor Packaging and Testing, New Energy, and ESG. Attendees can engage directly with experts and industry leaders, exploring trends and opportunities in the electronics manufacturing industry.
Cross-Industry Collaboration and Insights
NEPCON ASIA 2024 will co-locate with several other major events by RX, including the Electronics Sourcing Show, C-TOUCH & Display Shenzhen, Film & Tape Expo, Automotive World China, and AMTS & AHTE South China and form the 6-in-one mega event. This collaborative effort will help buyers explore cross-sector innovations, optimize supply chains, improve cost efficiency, and foster global industry collaboration.
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Infineon Beats Fiscal Year Start Expectations, Raises Outlook on Currency Effects
02/04/2025 | InfineonInfineon Technologies AG is reporting results for the first quarter of the 2025 fiscal year (period ended 31 December 2024).
Swissbit Unveils PCIe Gen4 SSD A1200
02/04/2025 | SwissbitSwissbit introduces the latest addition to its PCIe portfolio, the new A1200. The PCIe Gen4 M.2 SSD is designed to meet the demands of high-performance, mission-critical applications, focusing on consistent performance, low latency, and data integrity.
YINCAE Launches UF 120LA
02/04/2025 | YINCAEYINCAE has introduced UF 120LA, a high-purity liquid epoxy underfill engineered for advanced electronics packaging. With exceptional flowability into 20μ gaps, UF 120LA eliminates cleaning processes, reducing costs and environmental impact while ensuring superior performance across applications like BGA, flip chip, WLCSP, and multi-chip modules.
Building on DesignCon’s 30th Anniversary Momentum
02/04/2025 | Marcy LaRont, I-Connect007With three decades of technological advancements, DesignCon has established itself as a premier conference for electronics design. Susan Deffree, the group event coordinator, reflects on the event's rich history and the exciting developments for its 30th anniversary.
Creative Materials Releases New Solvent-Based Urethane Conformal Coating
02/03/2025 | Creative Materials, Inc.Creative Materials Inc., a leading innovator in specialty coatings, is proud to announce product: 111-27, a high dielectric strength solvent-based one-component urethane conformal coating designed to offer outstanding long-term performance in demanding environments primarily in the aerospace and defense field.