-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueSpotlight on India
We invite you on a virtual tour of India’s thriving ecosystem, guided by the Global Electronics Association’s India office staff, who share their insights into the region’s growth and opportunities.
Supply Chain Strategies
A successful brand is built on strong customer relationships—anchored by a well-orchestrated supply chain at its core. This month, we look at how managing your supply chain directly influences customer perception.
What's Your Sweet Spot?
Are you in a niche that’s growing or shrinking? Is it time to reassess and refocus? We spotlight companies thriving by redefining or reinforcing their niche. What are their insights?
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
Pre-registration Now Open for NEPCON ASIA 2024: Experience the Future of Electronics Manufacturing
August 23, 2024 | PRNewswireEstimated reading time: 2 minutes
NEPCON ASIA 2024, one of the most influential events in electronics manufacturing, organized by RX Shenzhen, will take place from November 6-8, 2024, at the Shenzhen World Exhibition & Convention Center (Bao'an). The event will feature over 600 top exhibitors from around the globe, showcasing cutting-edge technologies in circuit board assembly, semiconductor packaging, automation, and smart factory solutions. This annual gathering is a must-attend for industry professionals looking to reduce costs, optimize supply chains, and explore the latest innovations in the Asian electronics manufacturing sector.
Optimizing the Electronics Manufacturing Ecosystem
As new technologies like 5G, IoT, and AI continue to evolve, the electronics manufacturing industry is rapidly expanding across sectors such as consumer electronics, intelligent manufacturing, and new energy vehicles. NEPCON ASIA 2024 will feature leading companies presenting a wide range of solutions, from surface mounting and testing to automation and electronics materials. This one-stop event offers direct access to global suppliers, helping businesses enhance efficiency and stay ahead of the competition.
Spotlight on Power Semiconductor Packaging and Testing
The booming markets of new energy vehicles, smart grids, and third-generation semiconductors are driving the growth of the power semiconductor sector. NEPCON ASIA 2024 will showcase the latest advancements in this field with a dedicated area featuring new IGBT and SiC module packaging and testing production lines. Over 60 brands will present their cutting-edge equipment and materials, offering visitors a unique opportunity to optimize their production processes.
Introducing NEPCON ∞ SPACE in South China
As the global automotive electronics market is set to surpass USD350 billion by 2025, NEPCON ASIA is launching NEPCON ∞ SPACE in South China. This new feature will highlight automotive electronics through disassembly displays, technology salons, and immersive experiences. Industry experts will be on hand to share insights, making it an essential stop for those in automotive electronics.
Fostering Global Collaboration
China's electronics manufacturing industry continues to grow, driven by a strong PCBA production capacity and a comprehensive industrial chain. NEPCON ASIA 2024 will host a range of international activities, including business exchanges, matchmaking sessions, and factory visits, designed to promote cross-border collaboration and trade. The event will also feature a China Manufacturing PCBA and Smart Factory Technology Seminar, offering overseas buyers insights into China's innovative solutions.
Engage with Industry Leaders at Over 40 Forums & Events
NEPCON ASIA 2024 will host forums across five key segments: Electronics Manufacturing, Smart Factory & Automation, Semiconductor Packaging and Testing, New Energy, and ESG. Attendees can engage directly with experts and industry leaders, exploring trends and opportunities in the electronics manufacturing industry.
Cross-Industry Collaboration and Insights
NEPCON ASIA 2024 will co-locate with several other major events by RX, including the Electronics Sourcing Show, C-TOUCH & Display Shenzhen, Film & Tape Expo, Automotive World China, and AMTS & AHTE South China and form the 6-in-one mega event. This collaborative effort will help buyers explore cross-sector innovations, optimize supply chains, improve cost efficiency, and foster global industry collaboration.
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
EV Group Achieves Breakthrough in Hybrid Bonding Overlay Control for Chiplet Integration
09/12/2025 | EV GroupEV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, today unveiled the EVG®40 D2W—the first dedicated die-to-wafer overlay metrology platform to deliver 100 percent die overlay measurement on 300-mm wafers at high precision and speeds needed for production environments. With up to 15X higher throughput than EVG’s industry benchmark EVG®40 NT2 system designed for hybrid wafer bonding metrology, the new EVG40 D2W enables chipmakers to verify die placement accuracy and take rapid corrective action, improving process control and yield in high-volume manufacturing (HVM).
ROHM Develops Ultra-Compact CMOS Op Amp: Delivering Industry-Leading Ultra-Low Circuit Current
09/11/2025 | ROHMROHM’s ultra-compact CMOS Operational Amplifier (op amp) TLR1901GXZ achieves the industry’s lowest operating circuit current.
I-Connect007 Launches New Podcast Series on Ultra High Density Interconnect (UHDI)
09/12/2025 | I-Connect007I-Connect007 is excited to announce the debut of its latest On the Line With... podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI).
I-Connect007 Launches New Podcast Series on Ultra High Density Interconnect (UHDI)
09/10/2025 | I-Connect007I-Connect007 is excited to announce the debut of its latest podcast series, which shines a spotlight on one of the most important emerging innovations in electronics manufacturing: Ultra-High-Density Interconnect (UHDI). The series kicks off with Episode One, “Ultra HDI: What does it mean to people? Why would they want it?” Host Nolan Johnson is joined by guest expert John Johnson, Director of Quality and Advanced Technology at American Standard Circuits (ASC).
KYZEN to Feature High-Reliability MICRONOX Chemistries at IMAPS Symposium
09/10/2025 | KYZEN'KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, is pleased to announce its participation at the International Symposium on Microelectronics or IMAPS Symposium, taking place September 29-October 3 at Town & Country Resort in San Diego, CA.