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Current IssueDo You Have X-ray Vision?
Has X-ray’s time finally come in electronics manufacturing? Join us in this issue of SMT007 Magazine, where we answer this question and others to bring more efficiency to your bottom line.
IPC APEX EXPO 2025: A Preview
It’s that time again. If you’re going to Anaheim for IPC APEX EXPO 2025, we’ll see you there. In the meantime, consider this issue of SMT007 Magazine to be your golden ticket to planning the show.
Technical Resources
Key industry organizations–all with knowledge sharing as a part of their mission–share their technical repositories in this issue of SMT007 Magazine. Where can you find information critical to your work? Odds are, right here.
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Pre-registration Now Open for NEPCON ASIA 2024: Experience the Future of Electronics Manufacturing
August 23, 2024 | PRNewswireEstimated reading time: 2 minutes
NEPCON ASIA 2024, one of the most influential events in electronics manufacturing, organized by RX Shenzhen, will take place from November 6-8, 2024, at the Shenzhen World Exhibition & Convention Center (Bao'an). The event will feature over 600 top exhibitors from around the globe, showcasing cutting-edge technologies in circuit board assembly, semiconductor packaging, automation, and smart factory solutions. This annual gathering is a must-attend for industry professionals looking to reduce costs, optimize supply chains, and explore the latest innovations in the Asian electronics manufacturing sector.
Optimizing the Electronics Manufacturing Ecosystem
As new technologies like 5G, IoT, and AI continue to evolve, the electronics manufacturing industry is rapidly expanding across sectors such as consumer electronics, intelligent manufacturing, and new energy vehicles. NEPCON ASIA 2024 will feature leading companies presenting a wide range of solutions, from surface mounting and testing to automation and electronics materials. This one-stop event offers direct access to global suppliers, helping businesses enhance efficiency and stay ahead of the competition.
Spotlight on Power Semiconductor Packaging and Testing
The booming markets of new energy vehicles, smart grids, and third-generation semiconductors are driving the growth of the power semiconductor sector. NEPCON ASIA 2024 will showcase the latest advancements in this field with a dedicated area featuring new IGBT and SiC module packaging and testing production lines. Over 60 brands will present their cutting-edge equipment and materials, offering visitors a unique opportunity to optimize their production processes.
Introducing NEPCON ∞ SPACE in South China
As the global automotive electronics market is set to surpass USD350 billion by 2025, NEPCON ASIA is launching NEPCON ∞ SPACE in South China. This new feature will highlight automotive electronics through disassembly displays, technology salons, and immersive experiences. Industry experts will be on hand to share insights, making it an essential stop for those in automotive electronics.
Fostering Global Collaboration
China's electronics manufacturing industry continues to grow, driven by a strong PCBA production capacity and a comprehensive industrial chain. NEPCON ASIA 2024 will host a range of international activities, including business exchanges, matchmaking sessions, and factory visits, designed to promote cross-border collaboration and trade. The event will also feature a China Manufacturing PCBA and Smart Factory Technology Seminar, offering overseas buyers insights into China's innovative solutions.
Engage with Industry Leaders at Over 40 Forums & Events
NEPCON ASIA 2024 will host forums across five key segments: Electronics Manufacturing, Smart Factory & Automation, Semiconductor Packaging and Testing, New Energy, and ESG. Attendees can engage directly with experts and industry leaders, exploring trends and opportunities in the electronics manufacturing industry.
Cross-Industry Collaboration and Insights
NEPCON ASIA 2024 will co-locate with several other major events by RX, including the Electronics Sourcing Show, C-TOUCH & Display Shenzhen, Film & Tape Expo, Automotive World China, and AMTS & AHTE South China and form the 6-in-one mega event. This collaborative effort will help buyers explore cross-sector innovations, optimize supply chains, improve cost efficiency, and foster global industry collaboration.
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Incap Empowers the Next Generation of Skilled Professionals at Taitaja 2025
04/21/2025 | IncapIncap Corporation is proud to support the Taitaja 2025 Championship of vocational skills, Finland’s largest annual event dedicated to vocational education and training.
Cicor Acquires Significant Business Activities of Éolane
04/21/2025 | CicorCicor Group announces that its offer for the acquisition of significant business activities of the French Éolane Group has been accepted by the Paris Commercial Court. This strategic transaction marks a milestone in the execution of Cicor's pan-European growth strategy and further strengthens its market leadership in the aerospace and defence sector.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
04/18/2025 | Andy Shaughnessy, Design007 MagazineIt’s been a busy week in our industry. Never a dull moment! If you’ve been paying attention to our tariff tumult with China and its effect on the stock market, especially if your company does a lot of business with China, you might be tempted to call in a Xanax refill about now. But hang tight. This is still early in the first quarter. This brouhaha serves to underscore our need to manufacture critical laminates and components in the U.S. In this week’s must-reads, we have a potpourri of articles covering tariffs, the next generation of HDI, the three-year anniversary of IPC Mexico, a novel green technology, and emerging design trends.
Real Time with... IPC APEX EXPO 2025: Aster–Enhancing Design for Effective Testing Strategies
04/18/2025 | Real Time with...IPC APEX EXPOWill Webb, technical director at Aster, stresses the importance of testability in design, emphasizing early engagement to identify testing issues. This discussion covers the integration of testing with Industry 4.0, the need for good test coverage, and adherence to industry standards. Innovations like boundary scan testing and new tools for cluster testing are introduced, highlighting advancements in optimizing testing workflows and collaboration with other tools.
IPC President's Award: Barry Matties
04/21/2025 | Pete Starkey, I-Connect007The IPC President’s Award is given to IPC members who have exhibited ongoing leadership in IPC and have made significant contributions of their time and talent to the association and the electronic interconnect industry. Individuals can receive this award only once. Barry Matties has been a leading global force in publishing content about the electronics industry for nearly 40 years. He began his publishing career as a co-founder of CircuiTree Magazine in 1987, which became the leading printed trade journal serving the PCB industry.