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CEE PCB Appoints Jerome Larez to Field Application Engineer North America
August 26, 2024 | CEE PCBEstimated reading time: Less than a minute
Tom Yang, CEO of CEE PCB, has appinted industry veteran Jerome Larez to the position of Field Application Engineer (FAE) North America.
Mr. Larez has held several technical sales positions with printed circuit board companies, most recently with MicroConnex corporation. He started his career in the industry with Prototron Circuits in their Tucson facility and later the Redmond division. His career has crossed both engineering and sales, making him an ideal candidate for the new FAE position.
Mr. Yang said, “Jerome brings a depth of technical and sales knowledge as well as a great deal of experience in the North American PCB market. His experience, energy and passion for helping customers is exactly what we are looking for as we enter the North American PCB market.”
Added Mr. Larez, “I am looking forward to this new chapter in my life. The capabilities and technologies that CEE PCB brings to the market is something that I was really looking for in my next company. I am very optimistic about this new venture with CEE PCB.”
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Fresh PCB Concepts: The Journey of a PCB—A Tale of Sustainability and Circularity
09/12/2024 | Team NCAB -- Column: Fresh PCB ConceptsImagine a bustling factory floor where hundreds of PCBs hum with potential, each one destined to be the brain of a new electronic device. From the sleek smartphone in your pocket to the intricate systems in electric vehicles, PCBs are the unsung heroes of our digital world. But have you ever wondered what happens to these tiny powerhouses when their work is done? The journey of a PCB doesn’t end when a device reaches the end of its life. In fact, that’s where the next chapter begins—a chapter that’s critical for our environment and our future.
American Standard Circuits to Exhibit at Empire Expo & Tech Forum 2024
09/12/2024 | American Standard CircuitsAmerican Standard Circuits will be exhibiting at the Empire Expo & Tech Forum 2024 to be held at the DoubleTree By Hilton Syracuse, East Syracuse, New York on Thursday, September 26, 2024.
PSA ELNA Inaugurates New PCB Manufacturing Facility in Penang
09/11/2024 | PSA ELNAELNA PCB(M) SDN. BHD., a global supplier of printed circuit board (PCBs) and a subsidiary of Global Brands Manufacture under the PSA Group, announced the opening of its second state-of-the-art plant in Penang, Malaysia.
Beyond Design: Integrated Circuit to PCB Integration
09/11/2024 | Barry Olney -- Column: Beyond DesignTechnologies such as artificial intelligence, autonomous cars, smartphones, and wearable devices are significantly transforming the semiconductor industry. The miniaturization trend drives the IC footprint to an even smaller profile, requiring tighter margins. From the PCB designer’s perspective, smaller form factors are achievable, making devices more compact and lightweight. But double-sided SMT placement, reduced routing channels, and high-speed constraints create multiple challenges for designers. However, there are some advantages to miniaturization: shorter interconnects between the IC and the PCB reduce signal loss and electromagnetic interference. High-speed digital signals in the GHz range benefit from reduced parasitics.
TTM Selects Lamination Press From Lauffer and all4-PCB for New Syracuse Facility
09/10/2024 | all4-PCBall4-PCB is pleased to announce that TTM Technologies has chosen Lauffer GmbH & Co., Germany to supply the automated multilayer press system for TTM’s new facility in Syrcause, New York. The system will include hot and cold presses, storage towers, lay-up and depinning stations.