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CEE PCB Appoints Jerome Larez to Field Application Engineer North America
August 26, 2024 | CEE PCBEstimated reading time: Less than a minute
Tom Yang, CEO of CEE PCB, has appinted industry veteran Jerome Larez to the position of Field Application Engineer (FAE) North America.
Mr. Larez has held several technical sales positions with printed circuit board companies, most recently with MicroConnex corporation. He started his career in the industry with Prototron Circuits in their Tucson facility and later the Redmond division. His career has crossed both engineering and sales, making him an ideal candidate for the new FAE position.
Mr. Yang said, “Jerome brings a depth of technical and sales knowledge as well as a great deal of experience in the North American PCB market. His experience, energy and passion for helping customers is exactly what we are looking for as we enter the North American PCB market.”
Added Mr. Larez, “I am looking forward to this new chapter in my life. The capabilities and technologies that CEE PCB brings to the market is something that I was really looking for in my next company. I am very optimistic about this new venture with CEE PCB.”
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Sweeney Ng - CEE PCBSuggested Items
Partnerships Drive Innovation for a Brighter Manufacturing Future
08/26/2025 | Barry Matties, I-Connect007When Schweitzer Engineering Laboratories (SEL) opened its greenfield facility in 2023, it did so with careful attention to choosing its suppliers. In this discussion, Collin Peters, electronics business director for North America at MKS’ Atotech, and Justin Kennedy, manager of engineering at SEL, explore their unique partnership that includes collaborative efforts to develop innovative solutions like the Uniplate® PLBCu6 line.
Eltek Receives Purchase Orders Totaling $2.4 Million from Defense Contractor
08/25/2025 | PRNewswireEltek Ltd., a global manufacturer and supplier of technologically advanced solutions in the field of printed circuit boards, announced that it received orders totaling $2.4 million from a defense customer.
TTM Technologies: Bridging East and West with Strategic Expansion
08/25/2025 | Marcy LaRont, I-Connect007As global supply chains shift and demand for supply chain resiliency grows, TTM Technologies is expanding with purpose: bolstering its U.S. presence while maintaining a strong footprint in Asia. With recent moves in Wisconsin and Malaysia, the company is positioning itself to better support customers amid an evolving geopolitical landscape. In this interview, President and CEO of TTM Technologies Tom Edman discusses TTM’s expansion strategy, the future of manufacturing, and his planned retirement after his long tenure at the helm of the company.
CIMS to Exhibit at KPCA Show 2025
08/25/2025 | CIMSCIMS announced that it will exhibit at KPCA 2025, Korea’s premier annual PCB event, held this year in Incheon.
Global Flexible PCB Output Expected to Surpass $20 Billion by 2025, with AI Glasses Emerging as a New Growth Driver
08/25/2025 | TPCAThe Taiwan Printed Circuit Association (TPCA) and the Industrial Technology Research Institute (ITRI) released the "2025 Global Flexible PCB Industry Outlook" in August.