-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueWhat's Your Sweet Spot?
Are you in a niche that’s growing or shrinking? Is it time to reassess and refocus? We spotlight companies thriving by redefining or reinforcing their niche. What are their insights?
Moving Forward With Confidence
In this issue, we focus on sales and quoting, workforce training, new IPC leadership in the U.S. and Canada, the effects of tariffs, CFX standards, and much more—all designed to provide perspective as you move through the cloud bank of today's shifting economic market.
Intelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
- Articles
- Columns
- Links
- Media kit
||| MENU - smt007 Magazine
Dr. Jennie Hwang to Deliver Course on AI Opportunities, Challenges, Possibilities at SMTAI
August 28, 2024 | Dr. Jennie HwangEstimated reading time: 3 minutes

Dr. Jennie Hwang, Chair of AI Committee of National Academies/DoD AI study, Chair of Review Panel of National AI Institute of NSF, and Committee of Strategic Thinking for Engineering Research in the Era of Artificial Intelligence of NSF, brings broad-based information and insights through an integrated perspective to the AI course. A pioneer and long-standing leader in SMT manufacturing and lead-free implementation, the course provides working knowledge to all who are interested in acquiring pragmatic perspectives of the present and future of AI.
Monday, October 21 – 8:30AM -12:00PM
PDC9: “Artificial Intelligence Era – Opportunities, Challenges, Possibilities”
As moving into Artificial Intelligence (AI) era, the new AI tools and platforms are remaking our daily lives and every aspect of workplace including design, research, engineering, manufacturing and management across all industries - from semiconductor and printed circuit board design to life sciences and new material design. Even not being an AI technologist, staying in the core knowledge zone is a viable strategy to remain proficient and competitive in the workplace. This course will bring an up-to-date and a holistic overview of AI with the goal to spur innovative ideas and inspire new vistas to timely capitalize the sound benefits of AI to maximize on-job efficiency and effectiveness as well as business profitability and productivity. The recent emergence of ChatGPT and Generative AI makes use cases and “possible” future become more crucial to the on-job performance. The ability to balance between the AI’s omnipotent power and its downsides is key to leveraging AI as virtuous tools. Businesses will distinguish themselves by how well they use the tools and how reliable and safe the designed tools can deliver. This course maps out AI landsacpe including the current and future of AI development/deployment, demystifies prevalent notions, and outlines the prerequisite to win “AI game.” The key components behind AI technology including machine learning (ML), deep learning (DL), Neural Networks (NN), Internet of Things (IoT), digital twins, Large Language Model (LLM), AI with justified confidence/trust, ChatGPT industry use-cases will be highlighted along with tips and recommendations. No pre-requisite is required.
Topics:
- Background & diverse perspectives of AI
- Current state of AI
- AI – justified confidence
- AI – machine learning, deep learning, neural network, digital twin, IoT & use cases
- Generative AI, OpenAI – ChatGPT-4+
- Generative AI – prompt engineering - tips and recommendations
- Enterprise opportunities – jobs, examples
- Edge AI, private AI, data
- Global leaders & competitiveness – examples
- AGI - Artificial General Intelligence
- Brain, mind à intelligence
- Future of AI – near-term, mid-term, long-term
- Concluding remarks
About Dr. Jennie Hwang
International Hall of Famer of Women in Technogy, the author and co-author of ten (10) internationally-used textbooks and 700+ publications, a speaker at innumerable international and national events, she is Chair of Artificial Intelligence Committee of National Academies/DoD; Chair of Review Panel of National Artificial Intelligence Institute of NSF; Committee of Strategic Thinking for Engineering Research in the Era of Artificial Intelligence of NSF; Chair of National Laboratory Assessment Board; Chair of Assessment Board of Army Research Laboratory; Chair of Assessment Board of Army Engineering Centers; has also served on the Board of NYSE Fortune 500 companies and on various civic, government and university boards and committees (e.g., DoD - Globalization Committee, DoD - Forecasting Future Disruptive Technologies Committee, National Materials & Manufacturing Board, Board of Army Science and Technology, and Technical Assessment Board of NIST). She has received numerous honors and awards including International Hall of Fame of Women in Technology, National Academy of Engineering inductee and named R&D-Stars-to-Watch. Her formal education includes Harvard Business School Executive Program and four academic degrees in Metallurgical Engineering and Materials Science, Physical Chemistry, Organic Chemistry & Liquid Crystal Science (Ph.D. M.S., M.S., B.S.). She has held various senior executive positions with Lockheed Martin Corp., among others, and CEO of International Electronic Materials Corp. She is also an invited distinguished adj. professor of engineering School of Case Western Reserve University, and serves on the University’s Board of Trustees.
Suggested Items
High Density Packaging User Group (HDP) Welcomes Lincstech as New Member
07/01/2025 | High Density Packaging User GroupHigh Density Packaging User Group (HDP) is pleased to announce that Lincstech Co., Ltd. (Lincstech) has become a member.
Zhen Ding's 2025 Lean & Digital Initiative Presentation Conference Concludes Successfully, Driving Group Transformation
07/01/2025 | Zhen DingTo advance its digital transformation strategy and embody the CA- PDCA continuous improvement philosophy, Zhen Ding Technology Group (Zhen Ding) successfully hosted the 2025 H1 Lean & Digital Initiative Presentation Conference.
PCBA Market to Reach $147.5 Billion by 2035, Growing at a CAGR of 4.7% from 2025
06/27/2025 | PRNewswireThe Printed Circuit Board Assembly market is projected to reach $147.5 billion by 2035, up from an estimated $90.91 billion in 2025, growing at a steady CAGR of 4.7% during the forecast period.
North American PCB Industry Sales Up 21.4% in May
06/20/2025 | IPCIPC announced the May 2025 findings from its North American Printed Circuit Board (PCB) Statistical Program. The book-to-bill ratio stands at 1.03.
Global Electronics Association Debuts; New Name Elevates IPC’s 70-Year Legacy as Voice of $6 Trillion Electronics Industry
06/25/2025 | Global Electronics AssociationToday begins a new chapter for IPC as it officially becomes the Global Electronics Association, reflecting its role as the voice of the electronics industry. Guided by the vision of “Better electronics for a better world,” the Global Electronics Association (electronics.org) is dedicated to enhancing supply chain resilience and promoting accelerated growth through engagement with more than 3,000 member companies, thousands of partners, and dozens of governments across the globe.