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Indium to Highlight High-Reliability Solder Solutions at SMTA Guadalajara
August 28, 2024 | Indium CorporationEstimated reading time: 1 minute
Indium Corporation® will feature a range of industry-leading, high-reliability solder products at the Guadalajara Expo & Tech Forum in Guadalajara, Jalisco, Mexico, September 11-12.
Indium Corporation will showcase the following among its featured products:
- Durafuse® LT is an award-winning solder paste alloy system with versatile characteristics that enable energy savings, high reliability, and low-temperature step soldering. It's ideal for assemblies with large temperature gradients and large BGAs with complex warpage profiles. Durafuse® LT delivers superior drop shock performance, outperforming conventional low-temperature solders like BiSn or BiSnAg alloys, and even outperforms SAC305 with optimal process setup.
- Durafuse® HR, based on novel solder paste alloy technology, delivers enhanced thermal cycling performance (-40°C/125°C and -40°C/150°C) and superior voiding performance for high-reliability automotive applications. It also offers reduced solder joint cracking and increased shear strength.
- Indium8.9HF Solder Paste Series is an industry-proven solder paste series that delivers no-clean, halogen-free solutions designed to achieve high surface insulation resistance (SIR) and improve stability during the printing process for high-reliability automotive electronics.
- CW-818 is a flux-cored wire is designed to meet the demanding requirements of today’s manual and robotic soldering processes. CW-818 provides fast wetting speeds, allowing users to minimize cycle times. The spatter control technology minimizes flux spattering while the heat-resistant nature of the formula reduces flux build-up on the soldering iron tip as well as leaves a clear, non-tacky residue post-soldering (even when using a high iron tip temperature). The superior soldering performance, improved cleanliness, and excellent visual appearance post-soldering deliver a truly no-clean flux-cored wire.
To learn more about Indium Corporation’s solutions, visit our experts at booth #430 at the show.
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Brent Fischthal - Koh YoungSuggested Items
Rehm Wins Mexico Technology Award for CondensoXLine with Formic Acid
10/17/2025 | Rehm Thermal SystemsModern electronics manufacturing requires technologies with high reliability. By using formic acid in convection, condensation, and contact soldering, Rehm Thermal Systems’ equipment ensures reliable, void-free solder joints — even when using flux-free solder pastes.
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
Indium to Showcase High-Reliability Solder and Flux-Cored Wire Solutions at SMTA International
10/09/2025 | Indium CorporationAs one of the leading materials providers in the electronics industry, Indium Corporation® will feature its innovative, high-reliability solder and flux-cored wire products at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
‘Create your Connections’ – Rehm at productronica 2025 in Munich
10/08/2025 | Rehm Thermal SystemsThe electronics industry is undergoing dynamic transformation: smart production lines, sustainability, artificial intelligence, and sensor technologies dominate current discussions.