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CentraTEQ Appointed as UK Distributor for MB Dynamics' Squeak & Rattle Test Systems

09/11/2024 | CentraTEQ
CentraTEQ, a leading UK supplier of Vibration Test Systems, proudly announces its new partnership as the exclusive UK distributor for German company MB Dynamics, renowned for their advanced buzz, squeak, and rattle (BSR) test systems.

NASA, Boeing Welcome Starliner Spacecraft to Earth, Close Mission

09/10/2024 | NASA
NASA and Boeing safely returned the uncrewed Starliner spacecraft following its landing at 10:01 p.m. MDT Sept. 6 at White Sands Space Harbor in New Mexico, concluding a three-month flight test to the International Space Station.

Zero Defects International to Exhibit at Utah Expo and Tech Forum

09/04/2024 | Zero Defects International
Zero Defects International [ZDI] has announced their participation as an exhibitor at the SMTA Utah Expo and Tech Forum. It will be held at the Salt Lake City Marriott University Park.

Saki to Showcase Cutting-Edge Total Inspection Line Solutions at Productronica India 2024

08/28/2024 | Saki Corporation
Saki Corporation, an innovator in the field of automated optical and X-ray inspection equipment, is pleased to announce its participation at productronica India 2024, one of the premier trade events for the electronics manufacturing industry in the region.

Asymmetric Hybrid Printed Circuit Board Design: Warpage Considerations

08/27/2024 | Kaspar Tsang, Gause Hu, Jimmy Hsu, Aje Chang, Alan Sun, Brian Ho, Ryan Chang, and Thonas Su
The printed circuit board (PCB) accounts for a significant portion of the PCBA’s (printed circuit board assembly) BOM (bill of material) cost. Designs with hybrid PCB stackup are adopted to reduce the cost of the PCB by using less expensive laminate materials in layers that do not have routings for high-speed signals (e.g., power and ground layers). The conventional hybrid PCB stackup design is symmetrical in the middle. This engineering technique has been employed in the data center industry for quite some time. To extend the idea and optimize the purpose of hybrid PCB stackup design, the feasibility of an asymmetric hybrid stackup is currently being studied.
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