Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

OSI Systems Receives $6 Million Award for Patient Monitoring Solutions

10/31/2024 | BUSINESS WIRE
OSI Systems, Inc. announced that its Healthcare division, Spacelabs Healthcare®, has received an order valued at approximately $6 million to provide patient monitoring solutions and related supplies and accessories to a U.S. based hospital system.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

10/25/2024 | Marcy LaRont, I-Connect007
Just this month, the Fall issue of IPC Community was released, spotlighting the global activities of IPC and its members. SMT007 Magazine covers the scary situation around counterfeit components. Design007 Magazine is not playing tricks with its hard-hitting discussions about “partial HDI.” (If you are asking yourself what that is, you really need to take a look.) Finally, PCB007 Magazine’s alternate metallization issue offers some real treats, including an interview featured this past week with Carmichael Gugliotti of MacDermid Alpha. In you’re in the U.S., here’s to an early Happy Halloween.

DELO Introduces UV-approach for Fan-out Wafer-level Packaging

10/25/2024 | DELO
DELO has developed a new approach for fan-out wafer-level packaging (FOWLP). Its feasibility study shows: With the use of UV-curable molding materials instead of heat curing ones, warpage and die shift can be reduced significantly. Additionally, this leads to improvements in curing time and minimizes the energy consumption.

ERI Brings AI and Robotics Driven ITAD Services to Northeast Region

10/25/2024 | BUSINESS WIRE
ERI, the nation’s largest fully integrated IT and electronics asset disposition (ITAD) provider and cybersecurity-focused hardware destruction company, now maintains eight state-of-the-art e-waste recycling facilities, including its state-of-the-art location in Holliston, Massachusetts.

SIA Applauds CHIPS Act Incentives for Wolfspeed Manufacturing in North Carolina and New York

10/16/2024 | SIA
The Semiconductor Industry Association (SIA) today released the following statement from SIA President and CEO John Neuffer applauding semiconductor manufacturing incentives announced by the U.S. Department of Commerce and Wolfspeed.
Copyright © 2024 I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in