Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
Global Sourcing Spotlight: Balancing Speed and Flexibility Without Sacrificing Control
SMT Perspectives & Prospects: Artificial Intelligence Part 6: Data Module 1
STARTEAM GLOBAL Announces Strategic Partnerships with Notion Systems and Peters Group
September 3, 2024 | STARTEAM GLOBALEstimated reading time: 2 minutes
STARTEAM GLOBAL, an established printed circuit board (PCB) manufacturer with over 35 years of expertise, is pleased to announce new strategic partnerships with two German corporations: Notion Systems GmbH, a manufacturer of inkjet printing systems for functional materials, and Lackwerke Peters GmbH & Co. KG, also known as Peters Group, a full-range supplier of coating materials for electronics and PCBs worldwide.
Transition to Additive Solder Mask Process at New FST Factory
The technologies from Notion Systems and Peters Group will be integrated into STARTEAM’s new factory in Flero, Italy, named Flero STARTEAM (FST), transitioning from the traditional solder mask process to the emerging technology of the additive solder mask process. By integrating their innovations, the additive solder mask process is set to be revolutionised through their combined synergy.
Adoption of Notion Systems' Innovative n.jet Technology
FST will feature Notion Systems' n.jet solder resist system, which is scheduled for installation. By utilising Notion Systems’ cutting-edge inkjet technology, the FST factory will be able to digitally apply solder resist and legend. The inkjet technology offers rapid, efficient, and clean processing that aligns fully with sustainability strategies due to its digital and additive imaging capabilities. It significantly reduces the associated steps compared to the traditional solder mask process, allows for different resist thicknesses in different regions, offers high-level alignment, and supports custom automation — all under controlled and stable conditions.
Leveraging Peters’ Advanced Elpejet® Inkjet Solder Mask
With Peters’ inkjet solder mask Elpejet® IJ 2467 for additive manufacturing, this advanced technology enhances the production of superior print images. It boasts compatibility with all common print heads across various inkjet printers, ensuring precise edge coverage and coating thickness according to specifications. Additionally, it offers outstanding moisture and insulation resistance and remains crack-free even after multiple reflow soldering cycles.
Commitment to Enhance Quality and Efficiency in PCB Production
Utilising technologies from both Notion Systems and Peters, STARTEAM GLOBAL is optimising the additive solder mask process through collaborative innovation.
STARTEAM’s Chief Technology Officer, Martin Schneider, highlights the importance of this selection: “We chose Notion Systems and Peters Group because they offer a mature and easy-to-use technology, along with a very good support structure featuring close and cooperative collaboration right up to senior management. In general, we believe our cooperation will accelerate the integration of the additive solder mask process into the electronic market and PCB manufacturing industry, making PCB production more economical and ecological.”
This strategic move underscores STARTEAM's commitment to advancing PCB production technology, serving as a driver to elevate product quality and boost manufacturing efficiency.
Share on:
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Indium Experts to Deliver Technical Presentations at SMTA International
10/14/2025 | Indium CorporationAs one of the leading materials providers to the power electronics assembly industry, Indium Corporation experts will share their technical insight on a wide range of innovative solder solutions at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
Knocking Down the Bone Pile: Revamp Your Components with BGA Reballing
10/14/2025 | Nash Bell -- Column: Knocking Down the Bone PileBall grid array (BGA) components evolved from pin grid array (PGA) devices, carrying over many of the same electrical benefits while introducing a more compact and efficient interconnect format. Instead of discrete leads, BGAs rely on solder balls on the underside of the package to connect to the PCB. In some advanced designs, solder balls are on both the PCB and the BGA package. In stacked configurations, such as package-on-package (PoP), these solder balls also interconnect multiple packages, enabling higher functionality in a smaller footprint.
Indium to Showcase High-Reliability Solder and Flux-Cored Wire Solutions at SMTA International
10/09/2025 | Indium CorporationAs one of the leading materials providers in the electronics industry, Indium Corporation® will feature its innovative, high-reliability solder and flux-cored wire products at SMTA International (SMTAI), to be held October 19-23 in Rosemont, Illinois.
‘Create your Connections’ – Rehm at productronica 2025 in Munich
10/08/2025 | Rehm Thermal SystemsThe electronics industry is undergoing dynamic transformation: smart production lines, sustainability, artificial intelligence, and sensor technologies dominate current discussions.
Amplifying Innovation: New Podcast Series Spotlights Electronics Industry Leaders
10/08/2025 | I-Connect007In the debut episode, “Building Reliability: KOKI’s Approach to Solder Joint Challenges,” host Marcy LaRont speaks with Shantanu Joshi, Head of Customer Solutions and Operational Excellence at KOKI Solder America. They explore how advanced materials, such as crack-free fluxes and zero-flux-residue solder pastes, are addressing issues like voiding, heat dissipation, and solder joint reliability in demanding applications, where failure can result in costly repairs or even catastrophic loss.