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DuPont, Epicore Biosystems Collaborate to Advance Worker Safety Through Smart Wearable Technology

05/21/2025 | DuPont
Epicore Biosystems, a digital health solutions leader developing advanced sweat-sensing wearables, and DuPont Personal Protection (DuPont), a global leader in personal protection solutions, have agreed to work together to explore opportunities to potentially enhance worker safety and well-being.

SCHMID Group Honored with 'Best New Partner Award' from Founder PCB

01/14/2025 | SCHMID Group
The SCHMID Group is proud to announce that it has been honored with the prestigious “Best New Partner Award” from Founder PCB. This esteemed recognition highlights the success of a strong partnership and the shared pursuit of excellence that defines our collaboration.

Intel Unveils Next-Generation AI Solutions with the Launch of Xeon 6 and Gaudi 3

09/25/2024 | Intel
As AI continues to revolutionize industries, enterprises are increasingly in need of infrastructure that is both cost-effective and available for rapid development and deployment.

Sondrel’s SFA 100 is ideal for AI at the Edge

07/31/2024 | Sondrel
Sondrel (AIM: SND), a leading provider of ultra-complex custom chips for leading global technology brands, has optimised its SFA 100 to make it ideal for battery-powered, AI at the Edge applications.

SCHMID Group Takes Next Step Towards Advanced Packaging for Integrated Circuits with Glass Cores

05/29/2024 | GlobeNewswire
SCHMID Group N.V. (Nasdaq: SHMD) announces taking next step towards advanced packaging for integrated circuits with glass cores. Together with partners, the SCHMID Advanced IC Packaging Lab Solution is currently the sole supplier for full TGV lab with all process steps necessary to turn a bare glass substrate into an Advanced Integrated Circuit (IC) Package.
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