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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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PCB Design Takes Center Stage at FED’s Design Awards

09/17/2026 | Marcy LaRont, I-Connect007
PCB designers often work behind the scenes, but their decisions can determine whether an electronic product succeeds in manufacturing. At the FED Annual Conference in Germany on Sept. 23, the PCB Design Award 2026 will put that work in the spotlight. Marcy LaRont interviewed FED Managing Director Christoph Bornhorn and board member Erika Reel about what makes a winning design, and how the profession is changing as AI, automation, and other technologies reshape electronics development.

SMTA International Announces Keynote Speakers Exploring AI, Hybrid Electronics and the Future of Manufacturing

09/04/2026 | SMTA
The SMTA announced several keynote presentations taking place during the SMTA International Conference & Exposition, October 25 - 29, 2026 at the Donald E. Stephens Convention Center in Rosemont, IL, USA.

NHanced Semiconductors & University of Florida to Present on Advanced Packaging for Photonics at the 2026 SMTAI Conference

08/24/2026 | NHanced Semiconductors
The upcoming SMTA International Conference will feature a paper titled “Advanced Packaging for Photonics: Hybrid Bonding and Silicon Interposer Integration,” presented by NHanced Semiconductors vice-president Dr. Charles Woychik and Dr. Navid Asadizanjani from the Florida Semiconductor Institute at University of Florida.

NHanced Semiconductors, UF to Present Advanced Photonics Packaging at SMTAI 2026

08/18/2026 | PRNewswire
The upcoming SMTA International Conference will feature a paper titled “Advanced Packaging for Photonics: Hybrid Bonding and Silicon Interposer Integration,” presented by NHanced Semiconductors Vice President Dr. Charles Woychik and Dr. Navid Asadizanjani from the Florida Semiconductor Institute at University of Florida.

SMTA Announces Expansion of Advanced Electronics Assembly Conference into Asia

07/17/2026 | SMTA
The SMTA announced the Advanced Electronics Assembly Conference (AEAC) is expanding to Asia through a new partnership with the Thailand Printed Circuit Association (THPCA.)
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