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WHMA/IPC Issues Call for Participation for Electrical Wire Processing Technology Expo 2025
September 4, 2024 | IPCEstimated reading time: 1 minute
WHMA/IPC invites engineers, researchers, academics, technical experts, and industry leaders to submit proposals for the Electrical Wire Processing Technology Expo (EWPTE), to be held May 6-8, 2025 at Baird Center in Milwaukee, Wis. The deadline for proposals is on November 8, 2024.
Expert technical conference presentations and professional development courses are being sought in the following topic areas:
- Case Studies on A-620 Success
- Quality Requirements
- ESD Impacts on Harness
- ESD Transmission through Harnesses
- Hi Frequency Cabling
- X-ray Inspection Techniques
- Crimping Challenges/Dos and Don’ts
- Crimp Cross Sectioning
- Wire Harness Troubleshooting
- Reliability Issues and Failure Analysis
- Wiring Harness Education and Training
- Coil Winding
- Connector Advances
- Tooling
- Process Equipment/Productions
- Calibration
- Ultrasonics Splicing and Terminating
- Harness Design Drawings
- Engineering
- Overmolding
- Testing – Electrical/Environmental/
- Mechanical
- Electric Vehicles (EV)/Electric Mobility
- Cleanliness and FOD
- Wiring Harness Rework
Proposals must include an approximate 300-word abstract/summary of the presentation and description of what the audience will learn, and who will benefit from attending the presentation. Technical conference paper abstracts and course proposals are due November 8, 2024. For more information or to submit a proposal, visit https://app.oxfordabstracts.com/stages/75906/submitter. For questions regarding the technical conference at EWPTE, contact Julia Flynn, IPC/WHMA conference and events manager, at JuliaFlynn@ipc.org.
For additional information on attending or exhibiting, visit www.electricalwireshow.com, or contact Alicia Balonek, IPC/WHMA senior director of trade shows and events at AliciaBalonek@ipc.org.
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KYZEN’s Adam Klett to Present at 2025 SMTA Electronics in Harsh Environments Conference
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SEMICON Europa 2025 Call for Abstracts Opens for Advanced Packaging Conference and MEMS & Imaging Summit
05/05/2025 | SEMISEMI Europe announced the opening of the call for abstracts for SEMICON Europa 2025, to be held November 18-21 at Messe München in Munich, Germany. Selected speakers will share their expertise at the Advanced Packaging Conference (APC), MEMS & Imaging Sensors Summit, and during presentations on the show floor.
EIPC Summer Conference 2025: PCB Innovation in Edinburgh
04/18/2025 | EIPCEIPC have very wisely selected this wonderful city in Scotland as the venue for their Summer Conference on June 3-4. Whilst delegates will be distilling the proven information imparted by the speakers in the day, in the evening they will be free spirits at the Conference Dinner.
ASMC 2025 Showcases AI and Emerging Technologies Shaping the Future of Semiconductor Manufacturing
04/16/2025 | SEMIThe 36th annual Advanced Semiconductor Manufacturing Conference (ASMC) 2025 will be held May 5-8, 2025, in Albany, New York, bringing together leaders in semiconductor manufacturing to explore cutting-edge advancements driving high-volume production and AI-powered innovation.