-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueThe Rise of Data
Analytics is a given in this industry, but the threshold is changing. If you think you're too small to invest in analytics, you may need to reconsider. So how do you do analytics better? What are the new tools, and how do you get started?
Counterfeit Concerns
The distribution of counterfeit parts has become much more sophisticated in the past decade, and there's no reason to believe that trend is going to be stopping any time soon. What might crop up in the near future?
Solder Printing
In this issue, we turn a discerning eye to solder paste printing. As apertures shrink, and the requirement for multiple thicknesses of paste on the same board becomes more commonplace, consistently and accurately applying paste becomes ever more challenging.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
WHMA/IPC Issues Call for Participation for Electrical Wire Processing Technology Expo 2025
September 4, 2024 | IPCEstimated reading time: 1 minute
WHMA/IPC invites engineers, researchers, academics, technical experts, and industry leaders to submit proposals for the Electrical Wire Processing Technology Expo (EWPTE), to be held May 6-8, 2025 at Baird Center in Milwaukee, Wis. The deadline for proposals is on November 8, 2024.
Expert technical conference presentations and professional development courses are being sought in the following topic areas:
- Case Studies on A-620 Success
- Quality Requirements
- ESD Impacts on Harness
- ESD Transmission through Harnesses
- Hi Frequency Cabling
- X-ray Inspection Techniques
- Crimping Challenges/Dos and Don’ts
- Crimp Cross Sectioning
- Wire Harness Troubleshooting
- Reliability Issues and Failure Analysis
- Wiring Harness Education and Training
- Coil Winding
- Connector Advances
- Tooling
- Process Equipment/Productions
- Calibration
- Ultrasonics Splicing and Terminating
- Harness Design Drawings
- Engineering
- Overmolding
- Testing – Electrical/Environmental/
- Mechanical
- Electric Vehicles (EV)/Electric Mobility
- Cleanliness and FOD
- Wiring Harness Rework
Proposals must include an approximate 300-word abstract/summary of the presentation and description of what the audience will learn, and who will benefit from attending the presentation. Technical conference paper abstracts and course proposals are due November 8, 2024. For more information or to submit a proposal, visit https://app.oxfordabstracts.com/stages/75906/submitter. For questions regarding the technical conference at EWPTE, contact Julia Flynn, IPC/WHMA conference and events manager, at JuliaFlynn@ipc.org.
For additional information on attending or exhibiting, visit www.electricalwireshow.com, or contact Alicia Balonek, IPC/WHMA senior director of trade shows and events at AliciaBalonek@ipc.org.
Suggested Items
Disruptive Innovation and Generative AI Inventor, Kevin Surace, to Keynote IPC APEX EXPO 2025
11/15/2024 | IPCEach year, IPC APEX EXPO features industry’s most dynamic, innovative minds to deliver keynote presentations that are both educational and entertaining. IPC APEX EXPO 2025 will feature Kevin Surace, an internationally renowned futurist and generative artificial intelligence (AI) innovator.
2024 IPC CEMAC China Electronics Manufacturing Annual Conference Focuses on the Electronics Industry’s Future
10/24/2024 | IPCThe 2024 IPC CEMAC China Electronics Manufacturing Annual Conference, co-organized by IPC and the Shanghai Pudong New Area Quality Technology Association, kicked off with a grand opening ceremony in Shanghai. Themed "Making Your Imagination Reality," the event has brought together leaders, technical experts, and corporate representatives from the global electronics manufacturing industry to explore future trends and opportunities.
SEMICON Europa 2024 to Explore Innovations in Advanced Packaging and Fab Management for a Sustainable Future
10/15/2024 | SEMISemiconductor industry experts will convene at SEMICON Europa 2024, November 12-15 at Messe München in Munich, to explore the latest trends and innovations in advanced packaging and fab management.
OKI to Exhibit High-Reliability PCBs for Aerospace, Defense, and Telecommunications at PCB West 2024 in USA
10/08/2024 | BUSINESS WIREOKI announced that the OKI Group’s printed circuit board (PCB) company OKI Circuit Technology will participate in the PCB West 2024 Conference & Exhibition (PCB West), scheduled to take place from October 8 to 11 in Silicon Valley, USA. OTC will approach this event with the goal of expanding its customer base and sales in overseas markets, particularly in the United States.
SMTA International Announces Keynote Speaker: Jairek Robbins
09/13/2024 | SMTAThe SMTA International Conference & Expo is proud to announce Jairek Robbins as a keynote speaker at this year's event. He will be presenting on Wednesday, October 23 from 9:00 AM to 10:00 AM.