-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueThe Path Ahead
What are you paying the most attention to as we enter 2025? Find out what we learned when we asked that question. Join us as we explore five main themes in the new year.
Soldering Technologies
Soldering is the heartbeat of assembly, and new developments are taking place to match the rest of the innovation in electronics. There are tried-and-true technologies for soldering. But new challenges in packaging, materials, and sustainability may be putting this key step in flux.
The Rise of Data
Analytics is a given in this industry, but the threshold is changing. If you think you're too small to invest in analytics, you may need to reconsider. So how do you do analytics better? What are the new tools, and how do you get started?
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
WHMA/IPC Issues Call for Participation for Electrical Wire Processing Technology Expo 2025
September 4, 2024 | IPCEstimated reading time: 1 minute
WHMA/IPC invites engineers, researchers, academics, technical experts, and industry leaders to submit proposals for the Electrical Wire Processing Technology Expo (EWPTE), to be held May 6-8, 2025 at Baird Center in Milwaukee, Wis. The deadline for proposals is on November 8, 2024.
Expert technical conference presentations and professional development courses are being sought in the following topic areas:
- Case Studies on A-620 Success
- Quality Requirements
- ESD Impacts on Harness
- ESD Transmission through Harnesses
- Hi Frequency Cabling
- X-ray Inspection Techniques
- Crimping Challenges/Dos and Don’ts
- Crimp Cross Sectioning
- Wire Harness Troubleshooting
- Reliability Issues and Failure Analysis
- Wiring Harness Education and Training
- Coil Winding
- Connector Advances
- Tooling
- Process Equipment/Productions
- Calibration
- Ultrasonics Splicing and Terminating
- Harness Design Drawings
- Engineering
- Overmolding
- Testing – Electrical/Environmental/
- Mechanical
- Electric Vehicles (EV)/Electric Mobility
- Cleanliness and FOD
- Wiring Harness Rework
Proposals must include an approximate 300-word abstract/summary of the presentation and description of what the audience will learn, and who will benefit from attending the presentation. Technical conference paper abstracts and course proposals are due November 8, 2024. For more information or to submit a proposal, visit https://app.oxfordabstracts.com/stages/75906/submitter. For questions regarding the technical conference at EWPTE, contact Julia Flynn, IPC/WHMA conference and events manager, at JuliaFlynn@ipc.org.
For additional information on attending or exhibiting, visit www.electricalwireshow.com, or contact Alicia Balonek, IPC/WHMA senior director of trade shows and events at AliciaBalonek@ipc.org.
Suggested Items
Würth Elektronik at PEDC 2025
01/14/2025 | Wurth ElektronikOn January 29 to 30, 2025, the Pan-European Electronics Design Conference (PEDC) will convene leading experts from industry and research in Vienna.
EIPC Winter Conference to Explore Latest Trends in Electronics Manufacturing
12/31/2024 | EIPCThe European Printed Circuit Association (EIPC) is pleased to announce its upcoming Winter Conference, scheduled for February 4-5, 2025, at the DoubleTree by Hilton Hotel in Luxembourg City.
ZenaTech to Discuss AI Drone, US Defense Programs at Investor Conferences
12/30/2024 | ZenaTechZenaTech, Inc., a technology company specializing in AI (Artificial Intelligence) drone solutions driven by Quantum Computing, Drones as a Service, and enterprise SaaS, announces that it will participate at two upcoming January investor conferences to provide a business update.
IPC: PCB Designers Invited to Attend PEDC-Pan-European Electronics Design Conference
12/30/2024 | IPCThe Pan-European Electronics Design Conference (PEDC), co-hosted by FED and IPC, will take place on January 29-30, 2025. This two-day conference, held in English, will bring together global PCB designers for a comprehensive exchange of ideas and insights on the latest trends and technologies in electronics design.
IPC, FED Partner for New Design Conference in Vienna
12/12/2024 | Andy Shaughnessy, Design007 MagazineIPC and its German partner FED have teamed up to create a new PCB design conference in Vienna, Austria. The Pan-European Electronics Design Conference (PEDC) is scheduled for Jan. 29-30 at the NH Danube City hotel in Vienna. IPC’s Peter Tranitz, one of the show organizers, discussed how this new show came about, pointing out that, unlike many of the regional conferences in Europe, PEDC will host curated, peer-reviewed presentations, not promotional content or product pitches. Will PEDC become an annual event?