-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueThe Designer of the Future
Our expert contributors peer into their crystal balls and offer their thoughts on the designers and design engineers of tomorrow, and what their jobs will look like.
Advanced Packaging and Stackup Design
This month, our expert contributors discuss the impact of advanced packaging on stackup design—from SI and DFM challenges through the variety of material tradeoffs that designers must contend with in HDI and UHDI.
Rules of Thumb
This month, we delve into rules of thumb—which ones work, which ones should be avoided. Rules of thumb are everywhere, but there may be hundreds of rules of thumb for PCB design. How do we separate the wheat from the chaff, so to speak?
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - design007 Magazine
MICRONOX MX2123 to Lead KYZEN Offerings at The International Symposium on Microelectronics
September 5, 2024 | KYZEN'Estimated reading time: Less than a minute
KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, will exhibit at The 2024 International Symposium on Microelectronics scheduled to take place October 1-3, 2024 at the Encore Boston Harbor. The KYZEN clean team will showcase multi-process power module cleaner MICRONOX MX2123 during the event.
As demand for high-performance advanced packaging devices continues to rise, KYZEN proudly provides cleaning chemistries like MICRONOX MX2123 and process optimization services to meet the array of challenges faced by manufacturers.
MICRONOX MX2123 is a balanced, multi-phase chemistry designed to remove flux residues from a wide range of IGBT module devices that utilize combinations of copper, silver and nickel DBC as substrates. It can also remove fluxes from PCBs. MX2123 can remove slight metal oxidation from base metals for post wire bond and potting processes, leaving exceptional surface conditions after cleaning. It is effective at low temperatures, in low concentrations, and is easily monitored in in-line SIA or Ultrasonic Immersion cleaning systems.
The International Symposium of Microelectronics annually welcomes industry professionals and students for four days of microelectronics and advanced packaging technical programming and professional development courses.
Suggested Items
ITW EAE Achieves ISO 14001 Certification Across All Manufacturing Sites
01/14/2025 | ITW EAEITW EAE, the Electronic Assembly Equipment division of ITW, proudly announces that its manufacturing facilities in Camdenton, Missouri; Lakeville, Minnesota; and Suzhou, China have achieved ISO 14001 certification.
SEMI Industry Strategy Symposium 2025 Opens to Highlight Solutions for Managing Rapid Semiconductor Industry Growth
01/14/2025 | SEMIIndustry Strategy Symposium (ISS) 2025 sessions open gathering semiconductor industry executives for analysis of growth projections and pivotal business trends for the year ahead.
Weidmuller USA Celebrates 50 Years of Growth and Innovation
01/14/2025 | Weidmüller GroupWeidmuller USA is proud to celebrate its 50th anniversary in 2025, marking five decades as a pioneer of innovation in smart industrial connectivity and automation products and solutions.
Hot Off the Press: Explore the New Issue of IPC Community
01/14/2025 | IPC Community Editorial TeamThe latest digital copy of IPC Community, is now ready to view. Each quarter, IPC Community provides exclusive interviews and practical tips on what’s happening with IPC and its members. Find stories on IPC student leadership, successful women in business, the trouble with tariffs, the inside workings on an IPC mentorship duo, standards updates, and so much more.
SAMI-AEC Showcases Cutting-Edge Technological Solutions at IKTVA 2025
01/13/2025 | SAMISAMI Advanced Electronics Company (SAMI-AEC), a subsidiary of SAMI, is proud to announce its participation in the “IKTVA Forum and Exhibition 2025,” the region’s leading event for energy sector supply chains.