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Traditional electroless copper and electroless copper immersion gold have been primary PCB plating methods for decades. But alternative plating metals and processes have been introduced over the past few years as miniaturization and advanced packaging continue to develop.
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MICRONOX MX2123 to Lead KYZEN Offerings at The International Symposium on Microelectronics
September 5, 2024 | KYZEN'Estimated reading time: Less than a minute
KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, will exhibit at The 2024 International Symposium on Microelectronics scheduled to take place October 1-3, 2024 at the Encore Boston Harbor. The KYZEN clean team will showcase multi-process power module cleaner MICRONOX MX2123 during the event.
As demand for high-performance advanced packaging devices continues to rise, KYZEN proudly provides cleaning chemistries like MICRONOX MX2123 and process optimization services to meet the array of challenges faced by manufacturers.
MICRONOX MX2123 is a balanced, multi-phase chemistry designed to remove flux residues from a wide range of IGBT module devices that utilize combinations of copper, silver and nickel DBC as substrates. It can also remove fluxes from PCBs. MX2123 can remove slight metal oxidation from base metals for post wire bond and potting processes, leaving exceptional surface conditions after cleaning. It is effective at low temperatures, in low concentrations, and is easily monitored in in-line SIA or Ultrasonic Immersion cleaning systems.
The International Symposium of Microelectronics annually welcomes industry professionals and students for four days of microelectronics and advanced packaging technical programming and professional development courses.
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