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Advanced Electronics Packaging Digest

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Stay ahead of the technologies shaping the future of electronics with our latest newsletter, Advanced Electronics Packaging Digest. Get expert insights on advanced packaging, materials, and system-level innovation, delivered straight to your inbox.

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3 Key Takeaways: Understanding the Promise and Practical Limits of ELIC

10/26/2026 | I-Connect007
As semiconductor packages become smaller and more complex, PCB designers face increasing pressure to accommodate higher interconnect densities within tighter space constraints. Every layer interconnect (ELIC) technology offers a way to overcome some of the limitations of traditional HDI construction, but achieving greater density introduces new challenges in fabrication, reliability, and cost. In his white paper, ELIC: Every Layer Interconnect—The Promise, the Pain, and the Practical Limits, ASC President and CEO Anaya Vardya examines the advantages of ELIC architecture, the manufacturing challenges that accompany it, and the design decisions that determine whether a board can be produced reliably at scale.

Breaking Down the Barriers Between Design and Manufacturing in France

10/15/2026 | Marcy LaRont, I-Connect007 Magazine
The IPC Designers Council France has nearly doubled since I-Connect007 last reached out to Thomas Romont, a manager at WWEC who leads the council. But growth is only part of the story. Through working groups, practical design tools, and an annual conference, the council is creating opportunities for designers, engineers, fabricators, EMS providers, and other stakeholders to solve problems together. Thomas explains how the group is addressing gaps in design guidance, improving communication between design and manufacturing, and encouraging the kind of collaboration increasingly required across the electronics industry.

Connect the Dots: Getting the PCB Quote Right

09/30/2026 | Matt Stevenson -- Column: Connect the Dots
Once the PCB design moves from the designer’s hands to the fabricator, the quote process becomes much more than a matter of price. It’s where we determine what it will take to build your board successfully, from materials and capabilities to cost and production requirements. The more closely designers and fabricators work together during this stage, the better the opportunity to identify potential problems before they reach production.

ASC Sunstone Circuits to Exhibit and Present Lunch-and-Learn at PCB West 2026

09/21/2026 | ASC Sunstone Circuits
ASC Sunstone Circuits will exhibit at PCB West 2026, taking place September 29 through October 2 at the Santa Clara Convention Center in Santa Clara, California. The PCB West exhibition will be held Wednesday, September 30.

PCB Design Takes Center Stage at FED’s Design Awards

09/17/2026 | Marcy LaRont, I-Connect007
PCB designers often work behind the scenes, but their decisions can determine whether an electronic product succeeds in manufacturing. At the FED Annual Conference in Germany on Sept. 23, the PCB Design Award 2026 will put that work in the spotlight. Marcy LaRont interviewed FED Managing Director Christoph Bornhorn and board member Erika Reel about what makes a winning design, and how the profession is changing as AI, automation, and other technologies reshape electronics development.
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