Dan’s Biz Bookshelf: ‘Citizen Marketers: When People Are the Message’
It’s Only Common Sense: What To Do When They Won’t Answer the Phone
The Right Approach: ‘Twas the Night Before Christmas (Harley-style)
September Design007 Magazine: Silicon to Systems
September 9, 2024 | I-Connect007 Editorial TeamEstimated reading time: Less than a minute
Silicon to Systems: From Soup to Nuts
Traditionally, most designers of PCBs and ICs have operated in separate silos, unaware of much of what is happening just upstream or downstream. IC designers did their thing and PCB designers did theirs, and everything worked—until recently, that is.
Now, the increase in complexity in electronics is driving technologists throughout the electronics supply chain to adopt a “silicon to systems” outlook. Advanced packaging systems are causing PCB designers problems with signal integrity, power delivery requirements, and thermal issues.
This month, in the September 2024 issue of Design007 Magazine, we asked our expert contributors to weigh in on silicon to systems—what it means to PCB designers and design engineers, EDA companies, and the rest of the PCB supply chain—from soup to nuts.
Share on:
Suggested Items
IPC: PCB Designers Invited to Attend PEDC-Pan-European Electronics Design Conference
12/30/2024 | IPCThe Pan-European Electronics Design Conference (PEDC), co-hosted by FED and IPC, will take place on January 29-30, 2025. This two-day conference, held in English, will bring together global PCB designers for a comprehensive exchange of ideas and insights on the latest trends and technologies in electronics design.
Effects of Advanced Packaging and Stackup Design
12/26/2024 | I-Connect007 Editorial TeamKris Moyer teaches several PCB design classes for IPC and Sacramento State, including advanced PCB design. His advanced design classes take on some really interesting topics, including the impact of a designer’s choice of advanced packaging upon the design of the layer stackup. Kris shares his thoughts on the relationship between packaging and stackup, what PCB designers need to know, and why he believes, “The rules we used to live by are no longer valid.”
The Companion Guide to 'Designing for Reality' by Matt Stevenson Now Available
12/19/2024 | I-Connect007I-Connect007 is excited to announce the release of "The Companion Guide to...Designing for Reality," written by Matt Stevenson of ASC Sunstone Circuits. This essential resource builds on the foundational insights presented in "The Printed Circuit Designer’s Guide to... Designing for Reality" and delivers advanced strategies for scaling PCB production.
Global PCB Connections: Following DFM Rules Leads to Better Boards
12/18/2024 | Jerome Larez -- Column: Global PCB ConnectionsAs a PCB field applications engineer, ensuring smooth communication between PCB designers and fabricators is one of my frequent challenges. A critical part of that dialogue is design for manufacturing (DFM). Many designers, even experienced ones, often misunderstand or overlook important DFM considerations. They may confuse design rules with manufacturing minimums, leading to technically feasible designs that are difficult or costly to produce. In this column, I will clarify some common DFM guidelines and help designers understand the difference between “design rules” and “minimums” while sharing best practices that will simplify the production process and ensure the highest quality PCB.
The Shaughnessy Report: A Stack of Advanced Packaging Info
12/10/2024 | Andy Shaughnessy -- Column: The Shaughnessy ReportIt’s only fitting that this issue on advanced packaging and stackup features a “stackup” of “packages” on the cover. There’s certainly a lot to “unpack” in this issue. As advanced packaging moves further into the mainstream of PCB design, more PCB designers and design engineers are realizing this isn’t a plug-and-play technology. As we see in this issue, advanced packaging can have an impact on the entire design—the stackup in particular.