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September Design007 Magazine: Silicon to Systems
September 9, 2024 | I-Connect007 Editorial TeamEstimated reading time: Less than a minute
Silicon to Systems: From Soup to Nuts
Traditionally, most designers of PCBs and ICs have operated in separate silos, unaware of much of what is happening just upstream or downstream. IC designers did their thing and PCB designers did theirs, and everything worked—until recently, that is.
Now, the increase in complexity in electronics is driving technologists throughout the electronics supply chain to adopt a “silicon to systems” outlook. Advanced packaging systems are causing PCB designers problems with signal integrity, power delivery requirements, and thermal issues.
This month, in the September 2024 issue of Design007 Magazine, we asked our expert contributors to weigh in on silicon to systems—what it means to PCB designers and design engineers, EDA companies, and the rest of the PCB supply chain—from soup to nuts.
Suggested Items
The Shaughnessy Report: Are You Partial to Partial HDI?
10/08/2024 | Andy Shaughnessy -- Column: The Shaughnessy ReportSometimes, a little technology is all you need. Star Trek’s Borg character only needs a funky eyepiece contraption to access all The Collective’s data, like an outer space Wi-Fi. Like the Borg’s eyepiece, we may only need a little bit of HDI in one corner of the board. We might only need partial HDI.
October Issue of Design007 Magazine: Partial HDI
10/08/2024 | I-Connect007 Editorial TeamOur expert contributors provide a complete, detailed view of partial HDI this month. Most experienced PCB designers can start using this approach right away, but you need to know these tips, tricks and techniques first.
Silicon to Systems: Collaboration Between IC and PCB Design Continues
10/02/2024 | Andy Shaughnessy, Design007The walls are coming down between the designers of chips and PCBs. Because of the complexity of electronic systems, IC designers and PCB designers are increasingly finding themselves in need of information from technologists upstream and downstream, from silicon through the system level. Stephen Chavez, senior product marketing manager at Siemens, shares his thoughts on this silicon-to-systems approach and what it means for PCB designers, EDA tool providers, and system-level developers as well.
Silicon to Systems: A Wake-up Call for the Industry
09/26/2024 | Andy Shaughnessy, Design007 MagazineDuane Benson, founder of Positive Edge, has been working with silicon and packaging for longer than some of our newer readers have been alive. We asked him to share his thoughts on silicon to systems, which Duane says is much more than a buzzword—it’s a wake-up call for the industry.
Cross-domain Design: The Key to Managing Complex Methodologies
09/23/2024 | Andy Shaughnessy, Design007 MagazineFor years, Cadence Design Systems has been developing EDA tools that enable the design of ICs and PCBs. Now, as systems continually become more complex, the lines are blurring between these disciplines, and EDA companies are providing designers of PCBs and ICs the ability to understand what’s happening upstream and downstream. We asked John Park, product management group director for advanced IC packaging at Cadence, to discuss this ongoing convergence of domains, as well as what it all means to designers and design engineers.