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iNEMI Presents Packaging Interconnect Material Technology Series with Dr. Kazuhiro Nogita
September 9, 2024 | iNEMIEstimated reading time: Less than a minute
iNEMI, a leading electronics manufacturing industry association, is pleased to announce a two-part webinar series focusing on packaging interconnect material technology. Dr. Kazuhiro Nogita, a leading expert in the field, will present on September 17-24, 2024.
Webinar Series Details:
The webinars will provide valuable insights into:
- Properties of SnBi Low-Temperature Solders (September 17): This session will delve into the fundamental properties of tin-bismuth (SnBi) solder alloys, exploring their unique characteristics and challenges in high-strain rate deformation and thermal cycling.
- Transient Liquid Phase Bonding for High-Temperature Soldering Processes (September 24): This webinar will explore the use of transient liquid phase (TLP) bonding for reliable high-temperature interconnections with SnCu solders.
About the Speaker:
Dr. Kazuhiro Nogita is a highly regarded researcher with extensive experience in lead-free solders, interconnect materials, and more. He holds key positions at the Nihon Superior Centre for the Manufacture of Electronic Materials (NS CMEM) and the University of Queensland.
Registration:
Both webinars are open to industry professionals. Advance registration is required. Please visit the iNEMI site to register:
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