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Microsembly Furthers RF Hybrid Manufacturing Services with New Automated Wire Bonding and Die Attach Equipment

05/30/2025 | Microsembly
Microsembly, a US-based provider of high-frequency contract manufacturing services, has announced the addition of new state-of-the-art automated and manual wire and ribbon bonders to its advanced RF and microwave assembly, manufacturing, and testing facility.

Amphenol Printed Circuits Brings Its Boards to the 2025 IMSI

05/29/2025 | Amphenol Printed Circuits
Amphenol Printed Circuits will be offering a small but impressive sample of its vast design, manufacturing, and test capabilities in Radio Frequency (RF) printed circuit boards (PCBs) Rigid-Flex/Flex and backplanes at the 2025 IEEE MTT-S International Microwave Symposium exhibition.

StratEdge LPA-Series Semiconductor Packages Take Center Stage at CS Mantech and Space Tech Expo USA

05/07/2025 | StratEdge
StratEdge Corporation will display its thermally efficient Leaded Power Amplifier (LPA) packages in Booth 805 at CS Mantech.

Pasternack Announces RFMW as New Preferred Channel Partner in the UK

03/31/2025 | Pasternack
After more than 16 years as a dedicated Pasternack channel partner in the United Kingdom, Spectech has announced its retirement and will close business operations on March 31, 2025.

Aspocomp to Showcase Expertise at European Microwave Exhibition

09/16/2024 | Aspocomp
Aspocomp, a leading provider of advanced printed circuit board (PCB) solutions, is excited to announce its participation at the European Microwave Exhibition (EuMW) 2024.
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