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Advanced Electronics Packaging Digest

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Suggested Items

Remtec to Showcase Advanced Ceramic Technologies and Present Thermal Management for High-Power Applications at CMSE 2026

04/23/2026 | Remtec
Remtec, a global leader in advanced ceramic substrates and microelectronic assembly solutions, today announced that President and CEO Brian Buyea will lead the company’s participation at Components for Military & Space Electronics Conference & Exhibition (CMSE 2026).

Remtec: Advanced Ceramic PCB Solutions

03/27/2026 | Real Time with... APEX EXPO
Explore Remtec's advanced PCTF® technology and its critical role in power electronics and heat dissipation. Dan Beaulieu and Brian Buyea chat about Remtec's US-based manufacturing capabilities, innovative assembly processes, and the superior thermal conductivity of their ceramic substrates. Remtec is shaping the future of high-performance components for defense, aerospace, and automotive industries.

Voices of the Industry Podcast Examines Ceramic Substrates and Collaborative Manufacturing With Remtec

01/08/2026 | I-Connect007
Ceramic substrates continue to gain attention as electronics designers seek performance, reliability, and thermal advantages beyond traditional PCB materials. In the latest episode of Voices of the Industry, host Nolan Johnson welcomes Brian Buyea, president of Remtec, for an in-depth discussion on why ceramic substrates are an increasingly compelling option.
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