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Designers Notebook: Heterogeneous Interposer Design Challenge, Part 1

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The development of monolithic (system-on-chip) ICs revolutionized the electronics industry, enabling the creation of heterogeneous products by integrating multiple active elements within the same silicon base, which includes a central processing unit (CPU), memory functions, sensors, and communication tasks.

Cadence Launches Partner Ecosystem to Accelerate Chiplet Time to Market

01/12/2026 | Cadence Design Systems
Cadence announced a Chiplet Spec-to-Packaged Parts ecosystem to reduce engineering complexity and accelerate time to market for customers developing chiplets targeting physical AI, data center, and high-performance computing (HPC) applications.

Cadence Celebrates 20 Years in Pune, Reinforces Long-Term R&D Commitment

01/07/2026 | Cadence Design Systems
Cadence, a global leader in electronic system design, is celebrating 20 years in Pune as a core research and development hub.

onsemi to Develop Next-Generation GaN Power Devices with GlobalFoundries

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onsemi announced it has signed a collaboration agreement with GlobalFoundries (GF) to develop and manufacture advanced gallium nitride (GaN) power products using GF’s state-of-the-art 200mm eMode GaN-on-silicon process, starting with 650V.

Pan-European Electronics Design Conference Returns to Prague in January

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The Pan-European Electronics Design Conference is jointly hosted and organized by the Electronics Design and Manufacturing Association (FED) and the Global Electronics Association – two associations representing more than 3,700 companies from the electronics industry.
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