-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueAdvanced Packaging and Stackup Design
This month, our expert contributors discuss the impact of advanced packaging on stackup design—from SI and DFM challenges through the variety of material tradeoffs that designers must contend with in HDI and UHDI.
Rules of Thumb
This month, we delve into rules of thumb—which ones work, which ones should be avoided. Rules of thumb are everywhere, but there may be hundreds of rules of thumb for PCB design. How do we separate the wheat from the chaff, so to speak?
Partial HDI
Our expert contributors provide a complete, detailed view of partial HDI this month. Most experienced PCB designers can start using this approach right away, but you need to know these tips, tricks and techniques first.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - design007 Magazine
Smartkem, Chip Foundation Partner on MicroLED Backlight Tech
September 10, 2024 | PRNewswireEstimated reading time: 1 minute
Smartkem, a company that has the potential to power the next generation of displays using its disruptive organic thin-film transistors (OTFTs), announced that it has entered into a joint development agreement with Shanghai Chip Foundation Semiconductor Technology Co., Ltd., a manufacturer of semiconductor and integrated circuit devices, to co-develop a new generation of microLED-based backlight technology for Liquid Crystal Displays.
The joint development agreement provides that Smartkem will supply its proprietary organic dielectric single layer material, or Redistribution Layer (RDL), to Chip Foundation to combine with its own microLED devices, for the joint development of microLED based device structures. As part of the co-development project, Smartkem will develop insulator materials that can be used by Chip Foundation to combine its own proprietary microLED devices into a high performance miniLED package containing four microLEDs wired in series. The resulting manufactured chip is expected to have the properties of high brightness coupled with high current efficiency, reducing power losses in driving backlights and improving uniformity of illumination.
Smartkem Chairman and CEO, Ian Jenks, comments, "The JDA with Chip Foundation is expected to further demonstrate the commercial viability of our dielectric single layer materials to customers in the display industry. This JDA follows closely on the heels of our technology collaboration agreement with the Industrial Technology Research Institute (ITRI) in Taiwan to enable product prototyping on its Gen 2.5 hybrid pilot line and reflects the continuing advance of our commercialization strategy."
Dr. Maosheng Hao, Chairman of Chip Foundation, comments, "Smartkem is widely recognized as a leading provider of OTFT solutions, with deep expertise and extensive experience in organic dielectric materials, organic semiconductor materials, and related processes. Their solution coating process technology is a perfect fit with Chip Foundation's specialized processes and techniques in the Mini/MicroLED domain. We believe that this collaboration between our two companies has the potential to expedite the advancement and widespread adoption of this technology by the display industry."
Suggested Items
Biden-Harris Administration Announces CHIPS Incentives Award with Amkor Technology to Bring End-to-End Chip Production to the U.S.
12/25/2024 | U.S. Department of CommerceThe Biden-Harris Administration announced that the U.S. Department of Commerce awarded Amkor Technology Arizona, Inc., a subsidiary of Amkor Technology, Inc., up to $407 million in direct funding under the CHIPS Incentives Program’s Funding Opportunity for Commercial Fabrication Facilities.
SIA Statement on Biden Administration’s Launch of Section 301 Trade Investigation Related to China’s Targeting of the Semiconductor Industry for Dominance
12/25/2024 | SIAThe Semiconductor Industry Association (SIA) released the following statement from SIA President and CEO John Neuffer regarding the Biden administration’s decision to launch a Section 301 trade investigation focused on China’s acts, policies, and practices related to targeting of the semiconductor industry for dominance.
Texas Instruments Announces Award Agreement for CHIPS and Science Act Funding
12/25/2024 | Texas InstrumentsTexas Instruments (TI) (Nasdaq: TXN) and the U.S. Department of Commerce today announced an award agreement of up to $1.6 billion in direct funding through the U.S. CHIPS and Science Act, following the preliminary memorandum of terms announced in August 2024.
Biden-Harris Administration Announces CHIPS Incentives Award with Texas Instruments to Expand U.S. Capacity of Current-Generation and Mature-Node Chips
12/23/2024 | U.S. Department of CommerceThe Biden-Harris Administration announced that the U.S. Department of Commerce awarded Texas Instruments (TI) up to $1.61 billion in direct funding under the CHIPS Incentives Program’s Funding Opportunity for Commercial Fabrication Facilities.
Biden-Harris Administration Announces CHIPS Incentives Award with Samsung Electronics to Solidify U.S. Leadership in Leading-Edge Semiconductor Production
12/23/2024 | U.S. Department of CommerceThe Biden-Harris Administration announced that the U.S. Department of Commerce awarded Samsung Electronics (Samsung) up to $4.745 billion in direct funding under the CHIPS Incentives Program’s Funding Opportunity for Commercial Fabrication facilities.