Share on:

Share on LinkedIn Share on X Share on Facebook Share with email

Suggested Items

PCB Surface Topography and Copper Balancing Under Large Form Factor BGAs

10/01/2024 | Neil Hubble, Akrometrix and Gary A. Brist, Intel Corporation
As CPU and GPU packages grow larger and contain higher pin/ball counts, the importance of managing the printed circuit board (PCB) surface coplanarity for package assembly increases. The PCB surface coplanarity under a package is a product of both the global bow/twist of the PCB and the local surface topography under the package. In general, the surface topography is dependent the choice of material and layer stackup and the interaction between the innerlayer copper patterns and prepreg resin flow.

StratEdge Brings Gold Medal Performance with its Molded Ceramic and Post-fired Ceramic Packages, and High-reliability Assembly Services

08/14/2024 | StratEdge
StratEdge Corporation is redefining the landscape of semiconductor packaging with its cutting-edge molded and post-fired ceramic packages, supported by industry-leading high-reliability assembly services.

Reliability Comparisons of FPBGA Assemblies Under Hot/Cold Biased Thermal Cycle

08/06/2024 | Thomas Sanders, Seth Gordon, Reza Ghaffarian, Jet Propulsion Laboratory
Current trends in microelectronic packaging technologies continue in the direction of smaller, lighter, and higher density packages. The telecommunications industry and particularly mobile/portable devices have a strong need for lighter and smaller products. The current emerging advanced packaging (AP) technologies, including system-in-package (SiP) and 2.5D/3D stacked packaging, added another level of complexity and challenges for implementation.

SMTA Oregon Event Spreads Its Wings

06/25/2024 | Nolan Johnson, I-Connect007
Hillsboro, Oregon is home to the largest Intel campus in the United States as the base of operations for most of Intel’s CPU development. Hillsboro boasts experts and teams in IC and PCB physical layout, packaging, and R&D. Intel and satellite companies in its orbit deliver PCB fabrication and PCB assembly as well. So it's no surprise that SMTA Oregon’s annual meeting takes place practically in the shadows of Intel’s Hillsboro campus.

TopLine Introduces Braided Columns as Drop-in Replacement for BGA Solder Balls

06/17/2024 | TopLine
Copyright © 2024 I-Connect007 | IPC Publishing Group Inc. All rights reserved. Log in