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September 11, 2024 | StratEdgeEstimated reading time: 1 minute
StratEdge Corporation, leader in the design and production of high-performance semiconductor packages for microwave, millimeter-wave, and high-power devices, announces that it will be exhibiting in booth 923B at European Microwave Week (EuMW), being held at Porte de Versailles Paris, France from September 24-27, and booth 313 at IMAPS International Symposium for Microelectronics being held at the Encore Boston Harbor in Everett, Massachusetts, on October 1-2.
StratEdge designs and manufactures packages for RF, microwave, and millimeter-wave devices used in a wide variety of applications and industries. These hermetic and quasi-hermetic packages have ultra-low losses over wide frequencies. High-reliability designs feature high thermal conductivity and 50 ohm impedance transition designs. StratEdge packages have been proven on Mars, having powered the communications systems in the four most recent Mars Rovers. With expertise in high-frequency packages, StratEdge has been manufacturing in California since 1985.
StratEdge not only makes packages, but provides complete assembly services. Assembly is performed in StratEdge's ISO 9001:2015 facility, recently re-certified until 2027. Our facility contains a Class 1000 cleanroom and Class 100 work area with workstations for performing sensitive operations. Assembly services include manual and fully automatic wire and die bonding.
"Working with compound semiconductors, such as gallium nitride (GaN) or gallium arsenide (GaAs), requires a package that can best dissipate the heat from the device while ensuring that the device performs at its optimum potential," said Casey Krawiec, VP global sales for StratEdge. "Although the package plays the most critical part, the way the chip is assembled also has a significant impact on how the device performs. Please stop by our booth at EuMW or IMAPS Symposium to discuss your application."
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