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As electronics shrink and PCB density grows, traditional solder deposition methods such as stencil printing face significant challenges. One solution making substantial waves is solder paste jetting. Solder paste jetting is no secret. In fact, the development and commercialization of this technology has been around since the early 2000s. So, why now? We’ve arrived at a time in which the maturity of this technology has intersected with new demands of electronics manufacturing. This has opened doors to new frontiers in the world of electronics manufacturing. Here, we’ll explore the rise of paste jetting technology: enhancements seen in recent years, unique use cases for this technology, and the business segments in which we are seeing the growth of this technology.
Enhancements in Solder Paste Jetting
When looking at what has changed over recent years, several factors have contributed to the enhancements of solder paste jetting:
Improved valve and nozzle technology
Modern solder paste jetting systems have refined their nozzle and piezoelectric technologies, allowing for finer control over the deposition process. Enhanced materials and refined actuator design allow for more precise control, leading to finer and more accurate paste deposition. Systems are now capable of consistently achieving deposition sizes down to 200 mm.
Enhanced Software
Advances in software have given the user more sophisticated control over jetting parameters. These enhancements optimize the jetting process in real time, adjusting for factors like viscosity and environmental conditions to ensure consistent paste placement. Height mapping features can account for PCB warpage or even jetting on raised features or down into cavities.
To read the entire article, which originally appeared in the September 2024 issue of SMT007 Magazine, click here.
