-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueSoldering Technologies
Soldering is the heartbeat of assembly, and new developments are taking place to match the rest of the innovation in electronics. There are tried-and-true technologies for soldering. But new challenges in packaging, materials, and sustainability may be putting this key step in flux.
The Rise of Data
Analytics is a given in this industry, but the threshold is changing. If you think you're too small to invest in analytics, you may need to reconsider. So how do you do analytics better? What are the new tools, and how do you get started?
Counterfeit Concerns
The distribution of counterfeit parts has become much more sophisticated in the past decade, and there's no reason to believe that trend is going to be stopping any time soon. What might crop up in the near future?
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
Making Waves With Solder Paste Jetting
September 11, 2024 | Josh Casper, Horizon SalesEstimated reading time: 1 minute
As electronics shrink and PCB density grows, traditional solder deposition methods such as stencil printing face significant challenges. One solution making substantial waves is solder paste jetting. Solder paste jetting is no secret. In fact, the development and commercialization of this technology has been around since the early 2000s. So, why now? We’ve arrived at a time in which the maturity of this technology has intersected with new demands of electronics manufacturing. This has opened doors to new frontiers in the world of electronics manufacturing. Here, we’ll explore the rise of paste jetting technology: enhancements seen in recent years, unique use cases for this technology, and the business segments in which we are seeing the growth of this technology.
Enhancements in Solder Paste Jetting
When looking at what has changed over recent years, several factors have contributed to the enhancements of solder paste jetting:
Improved valve and nozzle technology
Modern solder paste jetting systems have refined their nozzle and piezoelectric technologies, allowing for finer control over the deposition process. Enhanced materials and refined actuator design allow for more precise control, leading to finer and more accurate paste deposition. Systems are now capable of consistently achieving deposition sizes down to 200 mm.
Enhanced Software
Advances in software have given the user more sophisticated control over jetting parameters. These enhancements optimize the jetting process in real time, adjusting for factors like viscosity and environmental conditions to ensure consistent paste placement. Height mapping features can account for PCB warpage or even jetting on raised features or down into cavities.
To read the entire article, which originally appeared in the September 2024 issue of SMT007 Magazine, click here.
Suggested Items
ASMPT: Innovative Bonding for Power Electronics
12/09/2024 | ASMPTASMPT presents with its SilverSAM™ SilverSAM machine a highlight for makers of modern power electronics: an innovative and versatile silver sintering machine that meets the great demands on bonding, which is particularly critical in the field of electromobility. SilverSAM sets new standards in interconnect technology for power electronics, particularly in the rapidly growing electric vehicle market.
Yamaha Robotics Brings Inspection Innovations for Growing Markets to electronica 2024
11/19/2024 | Yamaha Robotics SMT SectionYamaha Robotics SMT section presented innovations in high-speed surface-mount inspection at electronica 2024, demonstrating the latest AI skills and special features for applications including LED lighting, e-mobility, and mechatronics.
Data-driven Precision in PCBA Manufacturing
11/13/2024 | Julie Cliche-Dubois, CogiscanThe intricacies involved in electronics manufacturing require more than just expensive equipment and skilled technicians; they necessitate an accurate understanding of the entire production flow, informed and driven by access and visibility to reliable data.
All Flex Solutions Invests in Assembly Inspection Automation
10/17/2024 | All Flex SolutionsAll Flex has acquired an Omron VP9000 3D Solder Paste Inspection System and an Omron VT-S1080 3D Automatic Optical Inspection System for their flexible circuit assembly facility in Bloomington, Minnesota. These acquisitions are one part of All Flex Solutions’ four-year SMT Roadmap to expand the scale and capability of their assembly operations.
ViTrox Showcases Revolutionary SMT Inspection Solutions at SMTA International 2024
10/08/2024 | ViTroxViTrox, which aims to be the world’s most trusted technology company, is pleased to announce our participation in SMTA International (SMTAi) at Donald E. Stephens Convention Center, Booth #2111 and #2730 from 22 to 24 October 2024.