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Elementary, Mr. Watson: The Paradigm Shift of Silicon-to-System Design

09/18/2024 | John Watson -- Column: Elementary, Mr. Watson
Imagine you were asked to build a city. What approach would you take? In the old way, city planners designed each building independently. They focused on making each building strong, aesthetically pleasing, and valuable. But they didn't always consider how all the buildings would fit together in the city. Roads, power lines, and parks were added later, sometimes making the city confusing or complicated to get around.

Intel Awarded up to $3B by the Biden-Harris Administration for Secure Enclave

09/18/2024 | Intel
The Biden-Harris Administration announced today that Intel Corporation has been awarded up to $3 billion in direct funding under the CHIPS and Science Act for the Secure Enclave program. The program is designed to expand the trusted manufacturing of leading-edge semiconductors for the U.S. government.

Successful Rehm Technology Days 2024 – Where the Future Meets Technology

09/17/2024 | Rehm Thermal Systems
Traditionally, the Rehm Technology Days offer a valuable opportunity for knowledge exchange, networking and discussion. Once again this year, numerous customers, partner companies, press representatives and employees from the worldwide locations met at the company headquarters in Blaubeuren-Seissen.

TPY-4 Radar Completes Successful Risk Reduction Tests, 3DELRR program one step closer to battlefield success

09/17/2024 | Lockheed Martin
The U.S. Air Force Three-Dimensional Expeditionary Long Rang Radar (3DELRR) program team and Lockheed Martin successfully accomplished risk reduction testing for the TPY-4 radar.  This event demonstrated the radar’s performance in a variety of conditions.

IPC White Paper Calls for Comprehensive Roadmap to Address Advanced Packaging to Board-Level Integration Challenges

09/16/2024 | IPC
The increasing complexity of integrated systems demands a holistic approach to design, materials, assembly, reliability, and metrology across all levels of integration, from chip to package to board. IPC’s Technology Solutions group addresses these challenges and suggests a comprehensive roadmap in their new white paper, “Advanced Packaging to Board Level Integration—Needs and Challenges.”
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