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From Silos to Systems: 2026 and Beyond
Welcome to the debut issue of I-Connect007 Magazine. This publication brings all of the pieces together from PCB design and fabrication for a closer alignment and a more integrated electronics manufacturing landscape.
Designing Proper Work-Life Balance
In this issue, we hear from designers, marketers, and business owners on how they apply their professional skills to their personal lives to build a healthier work-life balance.
Designing Proper Planes
Without planes, designers would have to create thousands of traces to accomplish the same objectives. Power planes provide low impedance and stable power, and ground planes stabilize reference voltage, improve thermal performance, and help preclude EMI issues.
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PCB Designers: ‘Level Up’ IC, Packaging Knowledge
September 16, 2024 | Andy Shaughnessy, Design007 MagazineEstimated reading time: 1 minute
Soo Lan Cheah is kind of a unicorn in the industry. She is an IPC instructor based in Malaysia, and she has years of experience designing integrated circuits and printed circuit boards. I knew I had to get her thoughts for this issue on silicon-to-systems. I asked Soo Lan to discuss her cross-discipline background and what silicon-to-systems means to her.
Andy Shaughnessy: Please tell us a little about your background. It’s rare to meet someone with experience designing ICs and PCBs.
Soo Lan Cheah: I am currently an instructor for IPC PCB design certification in Asia and instructor-led online training. I’ve spent the past 20 years in Malaysia in engineering education and training, designing technical curricula for professional development, as well as national projects for upskilling local graduates and engineers in the semiconductor industry. Before this, I worked in Singapore as an engineer, for 15 years in the data communication network, doing R&D for the National Computing Center, Defense Advanced Electronics Laboratory, and Microelectronics Institute.
I started PCB design as a team member working on signal integrity simulations and test board designs for advanced PCB board products in the defense industry. I acquired electromagnetic field solver knowledge and techniques at the microelectronics institute while working on semiconductor IC package electrical design. The PCB and IC design’s formal certification for training came under a local training center in Malaysia, with a technology transfer program (PCB, IC design, and IC testing) from Japan to Malaysia. My contributions include developing the IC package design course for training and updating the PCB design and IC design courses.
I am fortunate to have been given numerous opportunities to upskill myself and be introduced to IPC design certifications. I owe a huge thank you to Tan Beng Teong. I am also grateful to my IPC mentors Dieter Bergman and Gary Ferrari for their guidance, patience, and generosity in the learning process that has inspired me to continue to update and guide new learners in the industry through IPC.
To read this entire conversation, which appeared in the September 2024 issue of Design007 Magazine, click here.
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February Issue of Advanced Electronics Packaging Digest Examines the Evolving Role of Packaging
02/11/2026 | I-Connect007 Editorial TeamI-Connect007 is excited to announce that the upcoming issue of Advanced Electronics Packaging Digest (AEPD) will be delivered to subscriber inboxes on Feb. 16, offering in-depth perspectives on the technologies and system-level thinking shaping the future of electronics packaging. As performance demands rise, advanced packaging is increasingly central to integration across the electronics ecosystem. This issue of AEPD examines how packaging decisions increasingly influence design, materials selection, manufacturing strategy, and overall system performance.
EIPC Winter Conference 2026 Review: The Keynote Sessions
02/11/2026 | Pete Starkey, I-Connect007Aix-en-Provence (pronounced “ex-ahn-pro-vonse”), a historic city and commune in the south of France, about 20 miles north of Marseille, was the pleasant venue for EIPC’s Winter Conference in early February. Industry delegates from 11 European countries, as well as from the U.S. and China, gathered at the Renaissance Hotel for a two-day programme, “Driving the Future: Innovation, Energy, and Sustainability in PCB Technology.” An added attraction was a privileged visit to the ITER fusion power project at the Cadarache research and development centre.
Design Village: Bringing the Design Community Front and Center
02/10/2026 | Peter Tranitz, Global Electronics AssociationWhen APEX EXPO returns to Anaheim in March, PCB designers and design engineers will find a new hub on the show floor: the Design Village, a dedicated exhibition area launched by the Global Electronics Association to elevate the design experience and foster deeper engagement across the electronics ecosystem.
Astera Labs Opens Israel Design Center to Support AI Connectivity Demand
02/09/2026 | Astera Labs, Inc.Astera Labs, Inc., a leader in semiconductor-based connectivity solutions for rack-scale AI infrastructure, announced a significant expansion of its global engineering operations with the establishment of an advanced research and development center in Israel.
Electronic Design Automation Market to Reach $35.3 Billion by 2032
02/05/2026 | Globe NewswireThe global electronic design automation market was valued at 15.8 billion in 2023 and is expected to reach US$ 35.3 billion by 2032, growing at a CAGR of 9.75% from 2024 to 2032.