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February Issue of Advanced Electronics Packaging Digest Examines the Evolving Role of Packaging

02/11/2026 | I-Connect007 Editorial Team
I-Connect007 is excited to announce that the upcoming issue of Advanced Electronics Packaging Digest (AEPD) will be delivered to subscriber inboxes on Feb. 16, offering in-depth perspectives on the technologies and system-level thinking shaping the future of electronics packaging. As performance demands rise, advanced packaging is increasingly central to integration across the electronics ecosystem. This issue of AEPD examines how packaging decisions increasingly influence design, materials selection, manufacturing strategy, and overall system performance.

EIPC Winter Conference 2026 Review: The Keynote Sessions

02/11/2026 | Pete Starkey, I-Connect007
Aix-en-Provence (pronounced “ex-ahn-pro-vonse”), a historic city and commune in the south of France, about 20 miles north of Marseille, was the pleasant venue for EIPC’s Winter Conference in early February. Industry delegates from 11 European countries, as well as from the U.S. and China, gathered at the Renaissance Hotel for a two-day programme, “Driving the Future: Innovation, Energy, and Sustainability in PCB Technology.” An added attraction was a privileged visit to the ITER fusion power project at the Cadarache research and development centre.

Design Village: Bringing the Design Community Front and Center

02/10/2026 | Peter Tranitz, Global Electronics Association
When APEX EXPO returns to Anaheim in March, PCB designers and design engineers will find a new hub on the show floor: the Design Village, a dedicated exhibition area launched by the Global Electronics Association to elevate the design experience and foster deeper engagement across the electronics ecosystem.

Astera Labs Opens Israel Design Center to Support AI Connectivity Demand

02/09/2026 | Astera Labs, Inc.
Astera Labs, Inc., a leader in semiconductor-based connectivity solutions for rack-scale AI infrastructure, announced a significant expansion of its global engineering operations with the establishment of an advanced research and development center in Israel.

Electronic Design Automation Market to Reach $35.3 Billion by 2032

02/05/2026 | Globe Newswire
The global electronic design automation market was valued at 15.8 billion in 2023 and is expected to reach US$ 35.3 billion by 2032, growing at a CAGR of 9.75% from 2024 to 2032.
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