Marcy’s Musings: Fueling the Workforce Pipeline
The Chemical Connection: Better Fabs Attract a Better Workforce
Dan’s Biz Bookshelf: ‘The New Age of Innovation’
Cirexx International Inc. Chooses atg A9 Flying Probe Technology for High-speed Electrical Test
September 19, 2024 | atg Luther & Maelzer GmbHEstimated reading time: Less than a minute
atg Luther & Maelzer GmbH confirms delivery of high-speed bare board testing technology to PCB fabricator, Cirexx International Inc., in Santa Clara, CA.
Consistent with the on-going investment in leading edge technologies at Cirexx International Inc., the A9 8 head, double-sided, high speed, high accuracy flying probe test system represents the newest addition to Cirexx’s test department. The latest atg technology enables Cirexx to test the most advanced ultra-fine designs while helping to reach industry leading throughput goals.
atg’s A9 can test pad sizes down to 35 micron and is capable of testing products up to a size of 21” x 24”. The A9 eliminates limitations due to test point density or fine-pitch contacts and features embedded component test, 4-wire Kelvin measurement capability with an accuracy of +/- 0,025 mΩ, HPOT and latent testing, all in combination with a test speed of up to 230 measurements/second.
Share on:
Suggested Items
iNEMI Packaging Tech Topic Webinar: Overcoming Challenges in 3D Packaging Test & Inspection
01/23/2025 | iNEMIRegister today for a free webinar on February 13th to explore emerging solutions for testing and inspecting complex 3D semiconductor packaging.
Datest Expands Reach in Florida with Whitlock Associates Partnership
01/23/2025 | DatestDatest, a trusted leader in advanced testing, engineering, inspection, and failure analysis services, is excited to announce the addition of Whitlock Associates to its network of sales representatives.
iNEMI and MIT Conduct Survey on Optical Adhesives for High-Volume Photonics
01/21/2025 | iNEMIThe International Electronics Manufacturing Initiative (iNEMI), in conjunction with MIT's FUTUR-IC initiative, is conducting a survey to understand the status of stakeholders, materials, applications, standards and test methods for high-volume deployment of optical adhesives for optoelectronics applications, particularly for silicon photonics and co-packaged optics.
TRI to Join SMTA Austin Expo 2025
01/16/2025 | TRITest Research, Inc. (TRI), the leading provider of test and inspection systems for the electronics manufacturing industry, is pleased to announce plans to exhibit at the SMTA Austin Expo 2025, scheduled to take place on February 6, 2025, at the Travis County Exposition Center.
Upcoming SMTA UHDI Symposium: Shortening the Learning Curve
01/15/2025 | Marcy LaRont, I-Connect007SMTA’s second annual UHDI Symposium on Jan. 23 in Phoenix will highlight groundbreaking discussions on UHDI assembly test board, innovative electronic inks, process controls, and signal integrity solutions. Organizer Tara Dunn talks about the importance of the event and how she prepared presentations and discussions that would appeal to fabricators, assemblers, and designers. This event will shorten your learning curve and spark new ideas that push the boundaries of hardware electronics manufacturing. There’s still time to register.