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Current IssueThe Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
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We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
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Cirexx International Inc. Chooses atg A9 Flying Probe Technology for High-speed Electrical Test
September 19, 2024 | atg Luther & Maelzer GmbHEstimated reading time: Less than a minute

atg Luther & Maelzer GmbH confirms delivery of high-speed bare board testing technology to PCB fabricator, Cirexx International Inc., in Santa Clara, CA.
Consistent with the on-going investment in leading edge technologies at Cirexx International Inc., the A9 8 head, double-sided, high speed, high accuracy flying probe test system represents the newest addition to Cirexx’s test department. The latest atg technology enables Cirexx to test the most advanced ultra-fine designs while helping to reach industry leading throughput goals.
atg’s A9 can test pad sizes down to 35 micron and is capable of testing products up to a size of 21” x 24”. The A9 eliminates limitations due to test point density or fine-pitch contacts and features embedded component test, 4-wire Kelvin measurement capability with an accuracy of +/- 0,025 mΩ, HPOT and latent testing, all in combination with a test speed of up to 230 measurements/second.
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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
06/13/2025 | Marcy LaRont, I-Connect007Today is Friday the 13th, and in much of Western folklore, this is a day when bad luck is lurking. But while Friday the 13th may top Western superstition charts, the global calendar is sprinkled with its own unlucky legends. In Spain and Greece, the bad juju lands on Tuesday the 13th—a day linked to Mars, the god of war, and naturally, chaos. In Italy, it’s Friday the 17th that is feared, thanks to the Roman numeral XVII, which can be rearranged to spell VIXI—Latin for “I have lived” (a poetic way of saying you’re dead).
TTCI Celebrates Melanie Rutkauskas’ 10-Year Anniversary and Her Leadership of New Training Division
06/12/2025 | TTCIThe Test Connection Inc. (TTCI), a leading provider of electronic test and manufacturing solutions, is proud to celebrate Melanie Rutkauskas on her 10-year anniversary with the company.
Bridging the Knowledge Gap in Test: A Conversation with Bert Horner
06/11/2025 | Barry Matties, I-Connect007Bert Horner is a seasoned industry veteran and co-creator of The Test Connection, Inc. (TTCI), a test and inspection company spanning over 45 years. In this candid conversation, Bert reflects on the challenges our industry faces with the retirement of career professionals and the subsequent loss of critical tribal knowledge. As he unveils The Training Connection’s innovative training initiatives, Bert emphasizes the importance of evolving educational programs that align with industry needs, particularly in design for test (DFT), and sheds light on strategies being implemented to foster the next generation of engineers.
IPC Hall of Fame Spotlight Series: Highlighting Bob Neves
06/11/2025 | Dan Feinberg, I-Connect007Many IPC members who have contributed significantly to IPC and our industry have been awarded the IPC Raymond E. Pritchard Hall of Fame (HOF) Award. This Hall of Fame spotlight features industry veteran Bob Neves, who joined IPC in 1986 and was inducted into the IPC Hall of Fame in 2007.
GEN3 Set to Host HATS²™ Technical Day at A.W. Technical Centre with Bob Neves
06/09/2025 | Gen3GEN3, a global leader in reliability testing and measurement solutions for the electronics industry, is excited to announce a dedicated HATS²™ Technical Day to be held at the A.W. Technical Centre in Farnborough, GEN3’s HQ. The event will showcase the HATS²™ (Highly Accelerated Thermal Shock) system with demos and presentations by Bob Neves, Chairman of RAS Inc. and creator of the HATS²™.