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Current IssueTechnology Roadmaps
In this issue of PCB007 Magazine, we discuss technology roadmaps and what they mean for our businesses, providing context to the all-important question: What is my company’s technology roadmap?
Wet Process Control
In this issue, we examine wet processes and how to obtain a better degree of control that allows usable data to guide our decisions and produce consistently higher-quality products.
Don’t Just Survive, Thrive
If we are to be relevant and prosper during these next critical decades in electronics, we must do more than survive. As an industry, we can and must thrive. In this issue, our contributors explore these concepts meant to help you take your business to the next level.
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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
September 20, 2024 | Andy Shaughnessy, I-Connect007Estimated reading time: 2 minutes
It’s been a busy week in the world of PCB design and manufacturing. In this week’s roundup, there’s a little bit of everything. We have a look at PCB technology of tomorrow, an interview with an engineer who designs both PCBs and ICs, and government relations news from Washington, D.C. We also have an article on dispensing technology, and a final installment of our podcast on “designing for reality.”
Fall is here, and I for one am glad it’s not 97 degrees anymore. I’m heading out to the Anaheim Electronics and Manufacturing Show and PCB West (AEMS), a new event by the same people who run the Del Mar Electronics Show near San Diego. I hope to see you at a show!
Global Perspectives: The Future of PCB Technology
Published September 18
Marcy LaRont brings us a great interview with Joe Dickson, a senior vice president at Wus Printed Circuit Co. Ltd., and one of the foremost experts on advanced PCB technologies. In this conversation, Joe discusses the trends he’s seeing in PCB fabrication around the globe, and he explains some new processes used at Wus, including additive circuitry carrier processing, also called “known good layers.” Check it out.
PCB Designers: ‘Level Up’ IC, Packaging Knowledge
Published September 16
Chip design and PCB design have been separate disciplines for decades. But we’re starting to see a blurring of the lines between these camps. In this interview, Soo Lan Cheah discusses the silicon-to-systems concept and what she’s learned over the years designing integrated circuits and printed circuit boards. Are PCB designers of the future going to be trained in chip design, and vice versa?
The Government Circuit: News on Defense Electronics, Europe, and Sustainability
Published September 17
I grew up five miles from Washington, D.C. This area was a swamp when Pierre L’Enfant laid out the city 200 years ago. Well, in some ways, it’s still a swamp, and IPC’s Chris Mitchell has the unenviable job of keeping an eye on the politicians and bureaucrats there. Some of our elected officials will “spit” in your ear and tell you it’s rain, especially in an election year. In his latest column, Chris provides updates on plans for government investment in the PCB community, particularly in defense, and a variety of electronics industry resolutions working their way through Congress. Always a good read.
Auguring in on Dispensing
Published September 19
Dispensing isn’t one of the more exciting operations in PCB assembly, but there have been a number of innovations in this field, particularly in the past few decades. In this conversation, Sunny Agarwal of Camalot Dispensers R&D breaks down some of the advances in dispensing technology since the 1990s, such as jet dispensers, as well as strategies like their CBI (customer-based innovation) model.
Routing, Final Fab, and QC: Don’t Miss the Final Episode of On the Line With… Designing for Reality
Published September 19
If you’re a regular reader, you’ve probably been following our podcast On the Line With… Designing for Reality. In this final installment of the series, Matt Stevenson of ASC Sunstone walks us through the last stages of PCB manufacturing, specifically from a “designing for reality” viewpoint. If we’re not designing for reality, we will have problems.
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Cirexx International Inc. Chooses atg A9 Flying Probe Technology for High-speed Electrical Test
09/19/2024 | atg Luther & Maelzer GmbHatg Luther & Maelzer GmbH confirms delivery of high-speed bare board testing technology to PCB fabricator, Cirexx International Inc., in Santa Clara, CA.
Routing, Final Fab, and QC: Don’t Miss the Final Episode of On the Line With… Designing for Reality
09/19/2024 | I-Connect007Don't miss the final episode of "On the Line With… Designing for Reality," in which ASC Sunstone General Manager Matt Stevenson wraps up his deep dive into the PCB manufacturing process with a discussion of Routing, Final Fabrication, and Quality Control.
Global Perspectives: The Future of PCB Technology
09/18/2024 | I-Connect007 Editorial TeamIt has been a while since we talked to a multi-company Asian-based PCB fabricator. Based on the markets served, Asia-based fabricators already utilize the highest-tech PCB processing equipment and materials. Where does that leave the rest of the world? Joe Dickson, an executive at Wus in China, candidly shares his observations, experiences, and perspective of an American working for an Asian-based PCB fabricator, envisioning a realistic future for the PCB fabrication industry.
Marcy's Musings: Charting the Future
09/17/2024 | Marcy LaRont -- Column: Marcy's MusingsI’m sure we all remember the days when driving somewhere new meant pulling out our handy atlas, or writing down all the specific instructions on how to get there before we left on our trips. Now, modern navigation systems are so sophisticated that they talk you through the process, reroute when you make a wrong turn, and tell you exactly what time you’ll arrive. One of the most beneficial aspects of these maps is hearing your next required move before you get there so you don’t miss a turn or go in the wrong direction. Wouldn’t it be nice if our technology roadmaps did the same, helping prevent missteps and avoid hazards? But deciding where to go and how to get there is completely in our own hands, as is ensuring we actually take the twists and turns we have so carefully laid out in our roadmaps. Therein, I believe, lies the biggest challenge of all.
PCB Designers: ‘Level Up’ IC, Packaging Knowledge
09/16/2024 | Andy Shaughnessy, Design007 MagazineSoo Lan Cheah is kind of a unicorn in the industry. She is an IPC instructor based in Malaysia, and she has years of experience designing integrated circuits and printed circuit boards. I knew I had to get her thoughts for this issue on silicon-to-systems. I asked Soo Lan to discuss her cross-discipline background and what silicon-to-systems means to her.