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BEST Inc. Offers Complete Portfolio of Electronic Component Salvaging Services

05/12/2025 | BEST Inc.
BEST Inc., a leader in electronic component services, is pleased to announce they offer a complete range of electronic component salvaging services. With more than 20 years of BGA salvaging experience, BEST has the knowledge, skills, and proper equipment to reliably remove and prepare components for later use in the assembly of printed circuit boards.

LG Innotek to Build FC-BGA into 700 Million USD Business with State-of-the-art Dream Factory

05/01/2025 | PR Newswire
LG unveiled the Dream Factory, a hub for the production of FC-BGAs (Flip Chip Ball Grid Arrays), the company's next-generation growth engine, to the media for the first time and announced it on the 30th April.

BEST Inc. Reports Record Demand for EZReball BGA Reballing Process

05/01/2025 | BEST Inc.
BEST Inc., a leader in electronic component services, is pleased to announce they are experiencing record demand for their EZReball™ BGA reballing process which greatly simplifies the reballing of ball grid array (BGA) and chip scale package (CSP) devices.

ASMPT Demonstrates Technology Leadership in SMT Assembly

04/09/2025 | ASMPT
The rapid development of artificial intelligence is driving the demand for high-performance processors and placing great demands on electronics manufacturing.

IPC Releases Latest List of Standards and Revisions

03/12/2025 | IPC
Each quarter, IPC releases a list of standards that are new or have been updated. To view a complete list of newly published standards and standards revisions, translations, proposed standards for ballot, final drafts for industry review, working drafts, and project approvals, visit ipc.org/status. These are the latest releases for Q1 2025.
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