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TRI Releases Core Features 3D AOI Solution
September 23, 2024 | TRIEstimated reading time: Less than a minute

Test Research, Inc. (TRI) is pleased to introduce the Core Features 3D AOI, TR7700QC SII, equipped with essential inspection functionalities tailored for the electronics manufacturing industry.
The Core Features 3D AOI features user-friendly programming for easy setup, flexible IPC-610 inspection algorithms, optional AI-powered solutions, and compliance with the latest Smart Factory standards. Featuring a 12 MP High-Speed Camera, it offers four factory-setting configurations ranging from high-resolution 10 μm to high-speed 15 μm.
Powered by IPC-610-compliant algorithms, the 3D AOI system can inspect the most intricate solder joint defects, including THT components. Interactive 3D models help operators quickly review detected defects, such as lifted BGA components, IC leads, connectors, switches, and other mounted devices.
The TR7700QC SII also features the Multi-Step Function, enabling efficient inspection of both tall (up to 40 mm) and short components during the same inspection. The TR7700QC SII supports current Smart Factory Standards, including the IPC-CFX and The Hermes Standard (IPC-HERMES-9852).
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IPC Rebrands as Global Electronics Association: Interview With Dr. John W. Mitchell
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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
06/20/2025 | Andy Shaughnessy, I-Connect007It’s been a busy week in this industry, and we have news and articles from the PCB design, fabrication and assembly communities. Some of this news is out of this world. We may be losing the high ground—the really high ground. Columnist Jesse Vaughan explains how the U.S. seems to be falling behind in space, and how this could affect our ability to defend ourselves in the future. We have an update on the U.S.-China tariff talks, which seem to be moving forward, though sometimes at a snail’s pace.