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Kitron Revises Outlook for Second Half 2024
September 23, 2024 | KitronEstimated reading time: Less than a minute
Reference is made to the outlook given in Kitron’s second-quarter report. The outlook for Central and Eastern Europe (CEE) sites has not picked up as expected. Several major customers within the market sectors Electrification and Industry have continued to reduce and postpone demand for the third and fourth quarters of 2024 as destocking continues and end markets have not developed as expected.
To facilitate further growth for the Nordic sites, where demand is strong, and stabilize the load for the CEE sites, several product transfers have been planned. Some of these transfers have been pushed to the first half of 2025.
For the third quarter, revenues are expected to be between EUR 140 and 150 million with an operating profit (EBIT) between EUR 8 and 10 million.
The full-year 2024 outlook is updated with revenues of between EUR 635 and 660 million with EBIT between EUR 44 and 50 million, including EUR 4.8 million in restructuring costs in the first quarter.
The previous outlook for the full year 2024 was revenues between EUR 660 and 710 million with EBIT between EUR 53 and 60 million, including EUR 4.8 million in restructuring costs in the first quarter.
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On the Line With… Podcast: UHDI and RF Performance
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The Marketing Minute: Cracking the Code of Technical Marketing
09/17/2025 | Brittany Martin -- Column: The Marketing MinuteMarketing is never a one-size-fits-all endeavor, but the challenges are magnified for highly technical industries like electronics. Products and processes are complex, audiences are diverse, and the stakes are high, especially when your customers are engineers, decision-makers, and global partners who depend on your expertise.
EV Group Achieves Breakthrough in Hybrid Bonding Overlay Control for Chiplet Integration
09/12/2025 | EV GroupEV Group (EVG), a leading provider of innovative process solutions and expertise serving leading-edge and future semiconductor designs and chip integration schemes, today unveiled the EVG®40 D2W—the first dedicated die-to-wafer overlay metrology platform to deliver 100 percent die overlay measurement on 300-mm wafers at high precision and speeds needed for production environments. With up to 15X higher throughput than EVG’s industry benchmark EVG®40 NT2 system designed for hybrid wafer bonding metrology, the new EVG40 D2W enables chipmakers to verify die placement accuracy and take rapid corrective action, improving process control and yield in high-volume manufacturing (HVM).
ROHM Develops Ultra-Compact CMOS Op Amp: Delivering Industry-Leading Ultra-Low Circuit Current
09/11/2025 | ROHMROHM’s ultra-compact CMOS Operational Amplifier (op amp) TLR1901GXZ achieves the industry’s lowest operating circuit current.