-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueCreating the Ideal Data Package
Why is it so difficult to create the ideal data package? Many of these simple errors can be alleviated by paying attention to detail—and knowing what issues to look out for. So, this month, our experts weigh in on the best practices for creating the ideal design data package for your design.
Designing Through the Noise
Our experts discuss the constantly evolving world of RF design, including the many tradeoffs, material considerations, and design tips and techniques that designers and design engineers need to know to succeed in this high-frequency realm.
Learning to Speak ‘Fab’
Our expert contributors clear up many of the miscommunication problems between PCB designers and their fab and assembly stakeholders. As you will see, a little extra planning early in the design cycle can go a long way toward maintaining open lines of communication with the fab and assembly folks.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - design007 Magazine
Book Excerpt: The Printed Circuit Designer’s Guide to... Thermal Management with Insulated Metal Substrates, Vol. 2, Chapter 4
September 25, 2024 | I-Connect007 Editorial TeamEstimated reading time: 1 minute

Chapter 4: Selecting IMS for High-Temperature Applications
The UL 746 test series offers a prediction indication on the lifetime of polymeric materials. In previous years, 100,000 hours has been used as an indication. New approvals are done with a calculation of 60,000 hours, which leads to some confusion when comparing figures stated in older technical datasheets against test results with new materials.
In practical terms, a MOT 130 material tested under the old regime would be required to retain at least half of the electrical and mechanical initial values after 100,000 hours. Using the new 60,000-hour tests of the UL, the same MOT 130 material could be approved with a new MOT of 140, a difference of about 10°C. Note that the technical datasheet for any given material may not specify whether the MOT is expressed in terms of the 60,000-hour or 100,000-hour tests.
Direct-bonded copper (DBC) with a ceramic base is a commonly used assembly technology. While advantages include excellent solder crack compensation due to similar CTE values between component and substrate, the construction is fragile and therefore places limits on size and exposure to vibration. Small assemblies in basic shapes such as a rectangle can be done, although larger, more complex shapes become difficult.
The latest IMS technologies can overcome these drawbacks. With the support provided by the aluminum base, the assembly can have almost any shape without compromising reliability. New materials like Ventec’s VT-4B5H, which has MOT of 155°C (according to UL 746E) and thermal conductivity of 4.2 W/mK (according to ISO 22007-2), can address a large variety of high-temperature applications such as power supplies, power converters, rectifiers, and motor drives for heavy industrial applications. Others include battery charging for electric vehicles, where high voltages are used for fast charging, as well as automotive ECUs that must withstand high temperatures such as in under-the-hood environments, and electric power steering (EPS).
Further development is increasing thermal conductivity towards 7 W/mK (according to ISO). In addition to enhancing high-temperature performance, this should also meet requirements such as high breakdown voltages and large creepage distances. Note also that increased thermal performance allows the usage of thicker dielectrics.
Suggested Items
FocalPoint Announces Strategic Collaboration with STMicroelectronics to Deliver an Enhanced GNSS Solution for Automotive
05/20/2025 | PRNewswireFocalPoint, a UK-based software company providing next-gen positioning solutions for automotive, wearables and smartphones, has announced a strategic collaboration with STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications.
Flexible PCB Market to Reach $61.75B by 2032, Driven by the Demand for Compact Electronics, Automotive and Medical Applications
05/16/2025 | Globe NewswireAccording to the SNS Insider, “The Flexible PCB Market was valued at USD 21.42 billion in 2023 and is expected to reach $61.75 billion by 2032, growing at a CAGR of 12.52% over the forecast period 2024-2032.”
Driving to the Future: A Pivotal Role in Standards for IPC China Automotive Electronics Committee
05/20/2025 | Sydney Xiao, IPCIn 2024, China’s automotive industry reached new heights. According to the China Association of Automobile Manufacturers (CAAM), the annual production of passenger vehicles surpassed 31 million units, marking a 4% year-over-year growth. Meanwhile, the production of new energy vehicles exceeded 12 million units, a remarkable 36.4% increase. Behind these impressive numbers lies a collective effort fueled by technological innovation, industrial upgrades, and the dedication of countless industry professionals.
Top 10 OSAT Companies of 2024 Revealed—China Players See Double-Digit Growth, Reshaping the Global Market Landscape
05/13/2025 | TrendForceTrendForce’s latest report on the semiconductor packaging and testing (OSAT) sector reveals that the global OSAT industry in 2024 faced dual challenges from accelerating technological advancements and ongoing industry consolidation.
Cadence, AVCC to Advance Physical AI Innovations for Autonomous Vehicles
05/12/2025 | Cadence Design SystemsCadence has joined the Autonomous Vehicle Computing Consortium (AVCC), marking a significant step forward in Cadence's commitment to advancing autonomous vehicle technology for the physical AI era by working with industry leaders to define high-performance computing (HPC) and safety solutions for next-generation autonomous vehicle systems.