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TSMC Expands Collaboration with Ansys by Integrating AI Technology to Accelerate 3D-IC Design

09/27/2024 | ANSYS
Ansys and TSMC have expanded their collaboration to leverage AI for advancing 3D-IC design and develop next generation multiphysics solutions for a wider array of advanced semiconductor technologies.

NC State CLAWS Hub to Lead $19 Million in ‘Leap Ahead’ Projects

09/25/2024 | NC State University
The White House and U.S. Department of Defense announced today the first year of funding, totaling $19 million, for four additional projects for the Commercial Leap Ahead for Wide Bandgap Semiconductors (CLAWS) Microelectronics Commons Hub, headed by North Carolina State University.

Würth Elektronik at electronica 2024

09/25/2024 | Wurth Electronics
Würth Elektronik is exhibiting at electronica – the leading international trade show – in Munich, November 12-15, 2024.

Book Excerpt: The Printed Circuit Designer’s Guide to... Thermal Management with Insulated Metal Substrates, Vol. 2, Chapter 4

09/25/2024 | I-Connect007 Editorial Team
Direct-bonded copper (DBC) with a ceramic base is a commonly used assembly technology. While advantages include excellent solder crack compensation due to similar CTE values between component and substrate, the construction is fragile and therefore places limits on size and exposure to vibration. Small assemblies in basic shapes such as a rectangle can be done, although larger, more complex shapes become difficult.

Renesas Leads ADAS Innovation with Power-Efficient 4th-Generation R-Car Automotive SoCs

09/24/2024 | Renesas
Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, expanded its popular R-Car Family of system-on-chips (SoCs) for entry-level Advanced Driver Assistance Systems (ADAS).
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