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Current IssueIPC APEX EXPO 2025: A Preview
It’s that time again. If you’re going to Anaheim for IPC APEX EXPO 2025, we’ll see you there. In the meantime, consider this issue of SMT007 Magazine to be your golden ticket to planning the show.
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Key industry organizations–all with knowledge sharing as a part of their mission–share their technical repositories in this issue of SMT007 Magazine. Where can you find information critical to your work? Odds are, right here.
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Amphenol Trackwise to Exhibit at electronica 2024
September 27, 2024 | Amphenol TrackwiseEstimated reading time: Less than a minute
Amphenol Trackwise Designs ltd will be exhibiting their weight and space saving, patented manufacturing process, Improved Harness Technology™ (IHT) at Electronica 2024, Munich from 12-15 November.
At the show, Amphenol Trackwise, who can be found in Hall A2, Booth 309, will showcase how Improved Harness Technology™ (IHT), can deliver space and weight savings – as well as increased repeatability and reliability – helping manufacturers in their journey towards sustainability and decarbonisation.
“With the All Electric Society very much on the horizon, we’re delighted to take our place alongside some of the most innovative solutions in the world of electronics.” said Philip Johnston, Amphenol Trackwise Business Unit Director. “We look forward to meeting with current and future customers and suppliers over the three days, and we invite anyone who would like to explore weight and space saving interconnect solutions to visit us in Hall 2, Booth 309.”
Suggested Items
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03/12/2025 | MicroCraftMicroCraft, a global leader in PCB testing and precision inkjet printing solutions, is set to showcase three cutting-edge models at IPC APEX EXPO 2025 at the Anaheim Convention Center March 18-20 in booth #4105. Each model represents the latest advancements in speed, accuracy, and automation across MicroCraft’s three product lines.
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03/12/2025 | PRNewswireTexas Instruments (TI) introduced the world's smallest MCU, expanding its comprehensive Arm® Cortex®-M0+ MSPM0 MCU portfolio. Measuring only 1.38mm2, about the size of a black pepper flake, the wafer chip-scale package (WCSP) for the MSPM0C1104 MCU enables designers to optimize board space in applications such as medical wearables and personal electronics, without compromising performance.
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