Bowman Signs Distribution Agreement with Nireco for Bowman's XRF Measurement Instruments in Japan

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Bowman Analytics, a global leader in the XRF (X-ray fluorescence) plating measurement industry, is proud to announce the signing of a new distribution agreement with Nireco. Bowman manufactures XRF analytical instruments for a wide variety of industries and applications such as semiconductors, electronic components, printed circuit boards (PCB), automotive, aerospace, general metal finishing, lead frames, and jewelry. Bowman XRFs are used for non-destructive measurements of elements from aluminum to uranium, with capability to measure up to 5 layers and 30 elements simultaneously.

Established in 1950 and headquartered in Hachioji City, Tokyo, Nireco has become a highly respected distributor specializing in advanced instrumentation solutions in Japan. They have extensive experience selling handheld XRF measurement systems, with Nireco’s sales consolidated to 9,861 million yen as of early 2024. From development and manufacturing to sales and maintenance services, Nireco does it all.

This partnership will expand Bowman’s presence in the Japanese market, enhancing the availability of its world-class XRF systems to a broader range of industries. With Bowman, Nireco will further expand its business in the semiconductor, electronic component, and PCB industries.

The semiconductor industry is currently reaching the limits of circuit miniaturization, and efforts are underway to improve performance by increasing the level of integration via multilayers. The development of next-generation package substrates to replace the resin substrates currently used for semiconductor packages is an innovative technology advancing in Japan and other countries. The multi-layered circuit pattern film thickness is important in the inspection of next-generation package substrates. Bowman XRF measurement systems, featuring a high-resolution solid-state detector and micro-focus X-ray tube, is designed to simultaneously measure substrates with ultra-thin films, multi-layer coatings, and compositions with exceptional precision. This advanced capability is ideal for use in R&D, production, and quality inspection of next-generation semiconductor packages, printed circuit boards, and electronic components. Bowman XRF systems can be utilized as standalone instruments or seamlessly integrated into automated production lines, offering unmatched versatility and accuracy.