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TRI Conformal Coating Inspection at Technology Workshop
October 1, 2024 | TRIEstimated reading time: Less than a minute

I-Tronik, TRI's distributor, is proud to announce the 13th Technology Workshop 2024 from October 24 to 25 in Vigonza, Padua, Italy. The two-day event will showcase the latest innovations in the electronics manufacturing industry, focusing on Conformal Coating, Cleaning and Control Processes featuring presentations from industry leaders. Attendees will have the opportunity to participate in technical presentations and hands-on experience.
The hands-on workshop will allow customers to experience TRI's latest Conformal Coating Inspection (CI AOI), the TR7700 SIII Ultra CI. The CI AOI is a high-speed, full-coverage coating inspection solution for coating thickness measurement and coating defect detection. The CI AOI can also inspect Flux and Glue defects. TRI's Inspection solutions are IPC-CFX compliant and support the current Smart Factory Standards, such as the IPC-DPMX and The Hermes Standard (IPC-HERMES-9852).
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
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‘Create your Connections’ – Rehm at productronica 2025 in Munich
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Axxon-Mycronic’s MYSmart MYC50 Wins 2025 Mexico Technology Award
09/19/2025 | Axxon-MycronicAxxon-Mycronic, a leading, global supplier of innovative and production-ready, dispensing and conformal coating systems, proudly announces that its MYSmart™ MYC50™ Inline Conformal Coating System has been honored with the 2025 Mexico Technology Award in the Conformal Coating Equipment category.
Curing and Verification in PCB Shadow Areas
09/17/2025 | Doug Katze, DymaxDesign engineers know a simple truth that often complicates electronics manufacturing: Light doesn’t go around corners. In densely populated PCBs, adhesives and coatings often fail to fully cure in shadowed regions created by tall ICs, connectors, relays, and tight housings.